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SKY65038-70LF PDF预览

SKY65038-70LF

更新时间: 2024-01-30 04:54:42
品牌 Logo 应用领域
思佳讯 - SKYWORKS 放大器
页数 文件大小 规格书
14页 234K
描述
0.25-6.0 GHz Low Noise Amplifier

SKY65038-70LF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOT-89
包装说明:,针数:4
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.82JESD-30 代码:R-XSSO-F3
长度:4.5 mm湿度敏感等级:1
功能数量:1端子数量:3
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.6 mm
标称供电电压:5 V表面贴装:YES
电信集成电路类型:RF AND BASEBAND CIRCUIT温度等级:INDUSTRIAL
端子形式:FLAT端子节距:1.5 mm
端子位置:SINGLE处于峰值回流温度下的最长时间:40
宽度:2.44 mmBase Number Matches:1

SKY65038-70LF 数据手册

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DATA SHEET • SKY65038-70LF LNA  
the ground pad to dissipate the maximum wattage produced  
to the circuit board. Multiple vias to the grounding layer are  
required.  
Evaluation Board Description  
The Skyworks SKY65038-70LF Evaluation Board is used to test  
the performance of the SKY65038-70LF LNA. An assembly  
drawing for the Evaluation Board is shown in Figure 10.  
5. All surface mount components are 0402-sized to reduce  
component parasitics. Use of 0603 or larger components is  
not recommended.  
Instead of using external surface mount components to test the  
Evaluation Board, broadband bias Ts were used to highlight the  
performance of the device, itself. Evaluation Boards are available  
for 250 MHz, 900 MHz, 1900 MHz, and 2100 MHz. Typical  
reference schematic diagrams are provided in Figures 11  
(250 MHz), 13 (900 MHz), 15 (1900 MHz), and 17 (2100 MHz).  
These are relatively wideband circuits that are useful for many  
applications.  
The different Evaluation Boards for the SKY65038-70LF are  
provisioned with two RF connectors and a DC launch. All boards  
have space for additional RF matching components. Unused  
series locations should be populated with 0 Ω resistors or strip  
lines. Unused shunt locations should be left unpopulated.  
Components in the feedback path from the RF input to the DC  
header should only be used if operating at less than +5 V.  
The following Tables describe the S-parameter performance and  
provide the Bill of Materials (BOMs) for the four available  
Evaluation Boards:  
Testing Procedure  
Use the following procedure to set up the SKY65038-70LF  
Evaluation Board for testing:  
250 MHz: Tables 5 and 6.  
900 MHz: Tables 7 and 8.  
1900 MHz: Tables 9 and 10.  
2100 MHz: Tables 11 and 12.  
1. Connect RF test equipment to the input/output SMA  
connectors.  
2. Connect DC ground.  
Table 13 provides scattering parameters for 250 MHz up to  
6000 MHz, calibrated to package leads.  
3. Connect VDD to a +5 V supply with a current of 200 mA.  
Verify that the board draws approximately 150 mA.  
4. Apply an RF signal or noise source.  
Biasing  
The voltage supply (VDD) should be applied to the RF_OUT pin  
through inductor L2. Decoupling capacitors C3 and C4 should be  
placed closely to L2.  
Package Dimensions  
Typical case markings for the SKY65038-70LF are shown in  
Figure 19. The PCB layout footprint is shown in Figure 20.  
Package dimensions for the 4-pin SOT-89 are provided in  
Figure 21, and tape and reel dimensions are shown in Figure 22.  
If a bias level lower than +5 V is used, the feedback resistor R1 is  
required. Use the following equation to determine the value of R1  
(do not install R1 for +5 V operation):  
§
·
VDD  0.37  
VDD  5  
3
¨
¨
¸
¸
R1    30 u 10 u  
(1)  
Package and Handling Information  
©
¹
Instructions on the shipping container label regarding exposure to  
moisture after the container seal is broken must be followed.  
Otherwise, problems related to moisture absorption may occur  
when the part is subjected to high temperature during solder  
assembly.  
Circuit Design Configurations  
The following design considerations are general in nature and  
must be followed regardless of final use or configuration.  
1. External components should be placed close to the package  
pins to reduce parasitics.  
The SKY65038-70LF is rated to Moisture Sensitivity Level 1  
(MSL1) at 260 qC. It can be used for lead or lead-free soldering.  
2. Care should be taken to ensure that all RF traces are 50 Ω.  
Care must be taken when attaching this product, whether it is  
done manually or in a production solder reflow environment.  
Production quantities of this product are shipped in a standard  
tape and reel format. For packaging details, refer to the Skyworks  
Application Note Tape and Reel, document number 101568.  
3. Paths to ground should be made as short as possible.  
4. The ground pad of the SKY65038-70LF LNA has special  
electrical and thermal grounding requirements. This pad is the  
main thermal conduit for heat dissipation. Since the circuit  
board acts as the heat sink, it must shunt as much heat as  
possible from the amplifier. As such, design the connection to  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
200794C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 9, 2009  
5

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