SEMIDRIVER
Absolute Maximum Ratings
Symbol Term
Value
18
Unit
V
Hybrid Double IGBT and
MOSFET Driver
SKHI 21, SKHI 21 H4
SKHI 22, SKHI 22 H4
VS
Supply voltage prim.
ViH
IiH
IGon
IGoff
Input signal voltage (HIGH) max.
Input signal current (HIGH)
Output current (peak) max.
Output current (peak) max.
VS + 0,3
0,34
3,3
V
mA
A
3,3
A
mA
IoutAVmax Output average current SKHI21/SKHI22 + 406)/+ 206)
VCE
Collector-emitter voltage sense
across the IGBTSKHI21/SKHI22
1200 / 1700
25 1)
V
dv/dt
Visol IO
Visol12
Rate of rise and fall of voltage
secondary to primary side
kV/µs
Isolation test volt. IN-OUT (RMS; 1min.)
input-output Version “H4": (1min.)
Isolation test voltage
2500
4000
V
V
output 1-output 2 (RMS; 1min.)
1500
V
Top
Tstg
Operating temperature
Storage temperature
– 40 ... + 85
– 40 ... + 85
°C
°C
Features
Electrical Characteristics
Value
SKHI 21/ 22
•
Double driver for half bridge mo-
dules
Symbol Term
Unit
V
•
•
•
•
SKHI 22 H4 is for 1700 V-IGBT
Drives MOSFETs VDS(on) < 10 V
CMOS compatible inputs
Short circuit protection by VCE
monitoring and switch off
Drive interlock top/bottom
Isolation by transformers
Supply undervoltage protection
(13 V)
VS
Supply voltage primary side
15 ± 0,6
160
typ.75/typ.110
12,9
IS
Iso
ViT+
Supply current primary side max
Supply current primary side no load
Input threshold voltage (HIGH) min.
Input threshold voltage (LOW) max.
Turn-on gate voltage output
Turn-off gate voltage SKHI 21/SKHI 22
Operating frequency IGBT/MOS
Coupling capacitances
Input-output turn-on propagation time
Input-output turn-off propagation time
Error input-output propagation time
Reference voltage for VCE monitoring 5) typ. 6; max. 9
mA
mA
V
ViT–
VG(on)
VG(off)
f
2,1
15
0/– 15
V
V
V
•
•
•
→ page B14-28
see fig. 3
typ. 1 + tTD
typ. 1
•
Error latch/output
Cps..
td(on) io
td(off) io
td(err)
VCEstat
pF
µs
µs
µs
V
Typical Applications
•
Driver for IGBT and MOSFET
modules in bridge circuits in
choppers, inverter drives, UPS
and welding inverters
typ. 1
•
DC bus voltage up to 1000 V.
External Components see fig. 1 and fig. 4
1)
Component
Function
Recommended
value
Primary/OUT2 =
10kV/µs +900 V
RTD
Dead time of interlock:
0 2)
2)
3)
Short circuit for tTD = 2,7 µs
Higher resistance reduces free-
wheeling diode peak recovery
current, increases IGBT turn-on
time. RON should be chosen so
that the turn-on delay time td(on)
does not exceed 1 µs. See also
Fig. 10
Higher resistance reduces turn-
off voltage spike, increases turn-
off time and turn-off power
dissipation. See also Fig. 10.
adjustable by RCE
t
TD (µs) = 2,7 + 0,13
Reference voltage for VCE monitoring:
CE (kΩ) – 25
10 + RCE (kΩ)
R
TD (kΩ)
RTD max.=100 kΩ
RCE
RCE = 24 kΩ
min. 10 kΩ
9
R
V
CEstat (V) =
(1) VCEstat = 5,6 V
max. 9 V
CCE
Inhibit time for VCE monitoring:
CCE = 0,33 nF
4)
max. 2,7 nF
tmin = 1,75 µs
max. 10 µs
15–VCEstat (V)
t
min = τCE In
(2)
(3)
10 – VCEstat (V)
10 RCE (kΩ)
10 + RCE (kΩ)
5)
6)
τ
CE (µs) = CCE (nF)
τCE = 2,3 µs
double when using half driver
RON
ROFF
Turn-on speed of the IGBT 3)
Turn-off speed of the IGBT 4)
min. 3,3 Ω
min. 3,3 Ω
© by SEMIKRON
0896
B 14 – 21