SK34AGQ-P THRU SK320AGQ-P
3A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
■Features
● Low profile package
■Outline
SMA(DO-214AC)
● Ideal for automated placement
● Guardring for overvoltage protection
● Low power losses, high efficiency
● High forward surge capability
0.067 (1.70)
0.047 (1.20)
0.114 (2.90)
0.083 (2.10)
Marking code
● Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
● Part no. with suffix “Q” means AEC-Q101 qualified
0.187 (4.75)
0.157 (4.00)
0.012 (0.30)
TYP.
0.098 (2.50)
0.067 (1.70)
■ Mechanical data
●
ackage: DO-214AC (SMA)
Molding compound meets UL 94 V-0 flammability
rating, RoHS-compliant, halogen-free
P
0.008 (0.20)
MAX.
0.061 (1.55)
0.030 (0.75)
0.224 (5.70)
0.185 (4.70)
● Terminals: Tin plated leads, solderable per
J-STD-002 and JESD22-B102
Dimensions in inches and (millimeters)
●
Cathode line denotes the cathode end
Polarity:
■Сircuit Diagram
■Maximum ratings and electrical characteristics
Rating at 25 OC ambient temperature unless otherwise specified.
SK310AGQ-P
SS310A
UNIT
Symbol SK34AGQ-P SK36AGQ-P
Parameter
SK315AGQ-P SK320AGQ-P
SK315Q
150
SK320Q
200
Marking Code
SS34A
SS36A
VRRM
VRMS
VR
Max. repetitive peak reverse voltage
Max. RMS voltage
40
28
100
V
V
V
A
60
42
70
105
140
Max. DC blocking voltage
Forward Rectified Current
40
60
100
150
200
I O
3.0
Forward Surge Current
@60Hz half-sine wave,1 cycle, Ta=25°C
IFSM
A
70
RθJA
RθJL
TSTG
TJ
55
Thermal Resistance (NOTE 1)
°C/W
17
OC
OC
Storage Temperature
-55 ~ +150
Operating Junction Temperature
-55 ~ +150
-55 ~ +125
Symbol
VF
Parameter
UNIT
V
SK310AGQ-P
0.85
SK34AGQ-P SK36AGQ-P
SK315AGQ-P SK320AGQ-P
0.90
Maximum instantaneous forward voltage
0.50
0.70
drop per drop @ IF = 3.0A
0.50
0.10
5.0
Maximum DC reverse current at rated DC @TJ = 25°C
IR
mA
blocking voltage per diode @ VRM=VRRM
@TJ = 100°C
10.0
Typical junction capactiance @VR=4V,f=1MHz
CJ
148
134
96
62
pF
NOTE :
1. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas
Document ID : DS-22K319
Revised Date : 2021/04/16
Revision : C
1