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SK1999ATF

更新时间： 2024-02-02 04:54:02

品牌	Logo	应用领域
商升特 - SEMTECH		时钟驱动器逻辑集成电路
页数	文件大小	规格书
30页	928K
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SK1999ATF 数据手册

SK19XX ꢀamily

1:9 Signal Distribution

PRELIMINARY

HIGH-PERꢀORMANCE PRODUCTS

SK19XX ꢀamily Package Information (continued)

5mm x 5mm TQꢀP

WITH

PLATING

e / 2

ꢁ

ꢀ

c 1

GAGE PLANE

ꢁ

ꢀ

(L1)

Figure 1.

Figure 2.

Figure 3.

JEDEC Variation

All Dimensions in Millimeters

Symbol

MIN

1.00

0.05

0.95

NOM

1.10

0.10

1.00

7.00 BSC

5.00 BSC

7.00 BSC

5.00 BSC

MAX

1.20

0.15

1.05

Note Comments

1. All dimensions and tolerancing conforms

to ANSI Y14.5M-1982.

2. The top package body size may be smaller

than the bottom package body size by as

much as 0.15 mm.

Package Stand Off Height

Air Gap

Package Body Thickness

3. To be determined at seating plane.

4. Dimensions D1 and E1 do not include

mold protrusion. Allowable protrusion

is 0.25 mm per side. D1 and E1 are

maximum plastic body size dimensions

including mold mismatch.

5. Details of Pin 1 identifier optional, but

must be located within the zone indicated.

6. All dimensions are in millimeters.

7. Dimension b does not include Dambar

protrusion. Allowable Dambar protrusion

shall not cause the lead width to exceed

the maximum b dimension by more than

0.08 mm. Dambar cannot be located

on the lower radius or the foot. Minimum

space between protrusion and an

adjacent lead is 0.07 mm for 0.4 mm and

0.5 mm pitch packages.

4, 2 Package Body Length

4, 2 Package Body Width

Lead Count

0.50 BSC

0.22

0.20

Lead Pitch

0.17

0.08

0^o

0.27

0.23

LeadsThicknes

0.20

7^o

3.5^o

0^o

11^o

12^o

13^o

11^o

12^o

0.20

0.09

0.45

0.20

0.16

0.75

8. Exact shape of each corner is optional.

9. These dimensions apply to the flat

section of the lead between 0.10 mm

and 0.25 mm from the lead tip.

10. A1 is defined as the distance from the

seating plane to the lowest point of the

package body.

0.60

1.00 REꢀ

0.20

0.08

aaa

bbb

ccc

ddd

Revision 1/January 23, 2001

www.semtech.com

1 2 345 6 7...30

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