SiHP24N80AEF
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THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYP.
MAX.
62
UNIT
Maximum junction-to-ambient
Maximum junction-to-case (drain)
RthJA
RthJC
-
-
°C/W
0.6
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX. UNIT
Static
Drain-source breakdown voltage
VDS
VGS = 0 V, ID = 250 μA
Reference to 25 °C, ID = 1 mA
VDS = VGS, ID = 250 μA
800
-
-
V
V/°C
V
VDS temperature coefficient
ΔVDS/TJ
VGS(th)
-
2
-
-
-
-
-
-
0.7
-
Gate-source threshold voltage (N)
-
4
VGS
VGS
=
=
20 V
30 V
-
100
nA
μA
μA
mA
Ω
Gate-source leakage
IGSS
IDSS
-
-
1
VDS = 640 V, VGS = 0 V
DS = 640 V, VGS = 0 V, TJ = 125 °C
VGS = 10 V ID = 10 A
1
Zero gate voltage drain current
V
-
2
0.195
-
Drain-source on-state resistance
Forward transconductance a
Dynamic
RDS(on)
gfs
0.170
9.4
VDS = 20 V, ID = 10 A
S
Input capacitance
Ciss
Coss
Crss
-
-
-
1889
63
-
-
-
VGS = 0 V,
Output capacitance
V
DS = 100 V,
f = 1 MHz
Reverse transfer capacitance
6
pF
nC
Effective output capacitance, energy
related
Co(er)
Co(tr)
-
-
51
-
-
VDS = 0 V to 480 V, VGS = 0 V
Effective output capacitance, time
related
328
Total gate charge
Qg
Qgs
Qgd
td(on)
tr
-
-
60
13
28
21
33
50
51
0.5
90
-
Gate-source charge
Gate-drain charge
Turn-on delay time
Rise time
VGS = 10 V
ID = 10 A, VDS = 640 V
-
-
-
42
66
100
102
1.1
-
VDD = 640 V, ID = 10 A,
GS = 10 V, Rg = 9.1 Ω
ns
V
Turn-off delay time
Fall time
td(off)
tf
-
-
Gate input resistance
Drain-Source Body Diode Characteristics
Rg
f = 1 MHz, open drain
0.2
Ω
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
Continuous source-drain diode current
Pulsed diode forward current
IS
-
-
-
-
20
46
A
G
ISM
S
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
VSD
trr
TJ = 25 °C, IS = 10 A, VGS = 0 V
-
-
-
-
-
1.2
254
1.6
-
V
ns
μC
A
127
0.8
12
TJ = 25 °C, IF = IS = 10 A,
di/dt = 100 A/μs, VR = 400 V
Qrr
IRRM
S21-1193-Rev. A, 13-Dec-2021
Document Number: 92426
2
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