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SH32N102J102 PDF预览

SH32N102J102

更新时间: 2024-04-09 18:53:49
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
27页 4413K
描述
1210, NPO, 1000pF, 1000Vdc

SH32N102J102 数据手册

 浏览型号SH32N102J102的Datasheet PDF文件第1页浏览型号SH32N102J102的Datasheet PDF文件第3页浏览型号SH32N102J102的Datasheet PDF文件第4页浏览型号SH32N102J102的Datasheet PDF文件第5页浏览型号SH32N102J102的Datasheet PDF文件第6页浏览型号SH32N102J102的Datasheet PDF文件第7页 
Multilayer Ceramic Capacitors  
Approval Sheet  
1. INTRODUCTION  
WTC soft termination series MLCC is designed and with a polymer layer within end terminations of product, which  
can absorb mechanical stress caused by PCB handling in SMT line and reduce the mechanical impact for product. It will  
offer more robust and reliable performance in applications.  
2. FEATURES  
3. APPLICATIONS  
a. MLCC’s termination are with a soft & flexible  
polymer layer to withstand high bending stress in SMT  
line.  
a. Power supply and related industries.  
b. Lighting industry.  
c. The other mechanical stress concerned products.  
b. Available for any item in standard series range.  
4. HOW TO ORDER  
SH  
31  
B
104  
K
500  
C
T
Series  
Size  
Dielectric  
Capacitance  
Tolerance  
Rated voltage  
Termination  
Packaging  
SH=Soft  
15=0402 (1005) N=NP0  
Two significant digits  
B=±0.1pF Two significant  
C=Ag Polymer T=7” reeled  
(C0G)  
B=X7R  
X=X5R  
termination  
18=0603 (1608)  
21=0805 (2012)  
31=1206 (3216)  
32=1210 (3225)  
42=1808 (4520)  
43=1812 (4532)  
46=1825 (4563)  
55=2220 (5750)  
56=2225 (5763)  
followed by no. of zeros. C=±0.25pF digits followed by  
/Ni/Sn  
G=13” reeled  
And R is in place of  
decimal point.  
Eg.  
D=±0.5pF no. of zeros. And  
F=±1%  
G=±2%  
J=±5%  
R is in place of  
decimal point.  
104=10x104  
6R3=6.3 VDC  
100=10 VDC  
=100nF  
K=±10%  
M=±20%  
160=16 VDC  
250=25 VDC  
500=50 VDC  
101=100 VDC  
201=200 VDC  
251=250 VDC  
401=400 VDC  
451=450 VDC  
501=500 VDC  
631=630 VDC  
102=1000 VDC  
152=1500 VDC  
202=2000 VDC  
252=2500 VDC  
302=3000 VDC  
402=4000 VDC  
Page 2 of 27  
ASC_Soft termination_(SH)  
Mar. 2024  

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