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SGBU4G PDF预览

SGBU4G

更新时间: 2022-02-26 11:11:23
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
3页 147K
描述
Glass Passivated Single Phase Bridge Rectifiers

SGBU4G 数据手册

 浏览型号SGBU4G的Datasheet PDF文件第2页浏览型号SGBU4G的Datasheet PDF文件第3页 
SGBU4D thru SGBU4M  
Glass Passivated Single  
Phase Bridge Rectifiers  
Reverse Voltage 200 to 1000V  
Forward Current 4.0 Amp  
Features  
y
y
y
Glass passivated die construction  
Ideal for printed circuit boards  
Plastic material used carries UL  
flammability recognition 94V-0  
High surge current capability  
High temperature soldering guaranteed:  
265/10 seconds, 0.375” (9.5mm) lead  
length, 5lbs. (2.3kg) tension  
y
y
Circuit  
Mechanical Data  
Case: Molded plastic case  
Terminals: Plated leads solderable per  
MIL-STD-750, Method 2026  
Polarity: Marked on Body  
Mounting Position: Any  
+
-
Module Type  
TYPE  
VRRM  
200V  
400V  
600V  
800V  
1000V  
VRSM  
300V  
500V  
700V  
900V  
1100V  
SGBU4D  
SGBU4G  
SGBU4J  
SGBU4K  
SGBU4M  
Maximum Ratings and Thermal Characteristics (TA = 25unless otherwise noted)  
Symbol  
IF(AV)  
Conditions  
Values  
Units  
Maximum average forward output rectified current Tc =100℃  
4.0 (1)  
A
Peak forward surge current single half sine-wave superimposed  
on rated load (JEDEC Method)  
90  
A
IFSM  
i2t  
Visol  
A2s  
V
33  
Rating for fusing (t<8.3ms)  
a.c.50HZ;r.m.s.;1min  
2500  
RθJA  
RθJC  
22(2)  
Maximum thermal resistance per leg  
/W  
4.2 (3)  
-55 to +150  
4.0  
Tj, TSTG  
Weight  
Operating Junction and storage temperature range  
Approximate Weight  
g
Electrical Characteristics (TA = 25unless otherwise noted)  
Symbol  
Conditions  
Values  
Units  
VF  
Maximum Instantaneous Forward Voltage per leg  
IFM =2.0A  
1.1  
V
Maximum DC reverse current at rated  
DC blocking voltage per leg  
TA = 25℃  
TA = 125℃  
5.0  
500  
IR  
µA  
Notes: (1) Heat sink, TC mouting-4x4x0.15cm thick copper plate  
(2) Junction to ambient without heatsink  
(3) Junction to case with heatsink  
(4) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for  
maximum heat transfer with M3 screw  
Document Number: SGBU4D thru SGBU4M  
Jun.25, 2010  
www.smsemi.com  
1

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