Datasheet > SGA9189Z-EVB1

SGA9189Z-EVB1

更新时间： 2022-02-26 10:26:19

品牌	Logo	应用领域
威讯 - RFMD		/
页数	文件大小	规格书
5页	351K
描述
Medium Power Discrete SiGe Transistor

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SGA9189Z-EVB1 数据手册

SGA9189Z

Pin Names and Descriptions

Name

Base

Description

RF input.

Connection to ground. Use via holes to reduce lead inductance. Place vias as close to ground leads as possible.

Emitter

Collector

Emitter

RF output.

Same as pin 2.

Recommended Mounting Configuration for Optimum RF and Thermal

Performance

Ground Plane

Plated Thru

Holes

(0.020" DIA)

SOT-89

Package

Machine

Screws

Mounting and Thermal Considerations

It is very important that adequate heat sinking be provided to minimize the device junction temperature. The following items

should be implemented to maximize MTTF and RF performance.

1. Multiple solder-filled vias are required directly below the ground tab (pin 4). [CRITICAL]

2. Incorporate a large ground pad area with multiple plated-through vias around pin 4 of the device. [CRITICAL]

3. Use two point board seating to lower the thermal resistance between the PCB and mounting plate. Place machine screws as

close to the ground tab (pin 4) as possible. [RECOMMENDED]

4. Use 2 ounce copper to improve the PCB’s heat spreading capability. [RECOMMENDED]

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

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DS121018

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