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SG32825CQ PDF预览

SG32825CQ

更新时间: 2024-02-21 05:37:48
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
7页 321K
描述
HIGH-SPEED CURRENT-MODE PWM

SG32825CQ 技术参数

生命周期:Active零件包装代码:QLCC
包装说明:QCCJ, LDCC20,.4SQ针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.67
其他特性:CAN ALSO BE CONFIGURED IN VOLTAGE MODE模拟集成电路 - 其他类型:SWITCHING CONTROLLER
控制模式:CURRENT/VOLTAGE-MODE控制技术:PULSE WIDTH MODULATION
最大输入电压:30 V最小输入电压:10 V
标称输入电压:15 VJESD-30 代码:S-PQCC-J20
长度:8.965 mm功能数量:1
端子数量:20最高工作温度:70 °C
最低工作温度:最大输出电流:0.01 A
封装主体材料:PLASTIC/EPOXY封装代码:QCCJ
封装等效代码:LDCC20,.4SQ封装形状:SQUARE
封装形式:CHIP CARRIER认证状态:Not Qualified
座面最大高度:4.78 mm子类别:Switching Regulator or Controllers
表面贴装:YES切换器配置:PUSH-PULL
最大切换频率:1500 kHz技术:BIPOLAR
温度等级:COMMERCIAL端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
宽度:8.965 mmBase Number Matches:1

SG32825CQ 数据手册

 浏览型号SG32825CQ的Datasheet PDF文件第1页浏览型号SG32825CQ的Datasheet PDF文件第3页浏览型号SG32825CQ的Datasheet PDF文件第4页浏览型号SG32825CQ的Datasheet PDF文件第5页浏览型号SG32825CQ的Datasheet PDF文件第6页浏览型号SG32825CQ的Datasheet PDF文件第7页 
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7  
SG1825C/SG2825C/SG3825C  
H I G H - S P E E D C U R R E N T - M O D E P W M  
N O T R E C O M M E N D E D F O R N E W D E S I G N S  
ABSOLUTE MAXIMUM RATINGS (Note 1)  
PACKAGE PIN OUTS  
RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)......................................................... 260° (+0, -5)  
Input Voltage (VIN and VC).......................................................................................... 30V  
Analog Inputs:  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
INV. INPUT  
N.I. INPUT  
E/A OUTPUT  
CLOCK  
VREF  
+VIN  
OUTPUT B  
VC  
PWR GND  
OUTPUT A  
GROUND  
ILIM / S.D.  
Error Amplifier and Ramp ........................................................................-0.3V to 7.0V  
Softstart and ILIM/S.D. ................................................................................-0.3V to 6.0V  
Digital Input (Clock) ....................................................................................1.5V to 6.0V  
Driver Outputs ........................................................................................-0.3V to VC+1.5V  
Source / Sink Output Current (each output):  
RT  
CT  
RAMP  
SOFTSTART  
Continuous .............................................................................................................. 0.5A  
Pulse, 500ns ............................................................................................................ 2.0A  
Softstart Sink Current................................................................................................ 20mA  
Clock Output Current................................................................................................. 5mA  
Error Amplifier Output Current ................................................................................. 5mA  
Oscillator Charging Current ....................................................................................... 5mA  
Operating Junction Temperature:  
Hermetic (J, L Package) ....................................................................................... 150°C  
Plastic (DW, N, Q Packages) ............................................................................... 150°C  
Storage Temperature Range......................................................................-65°C to 150°C  
Lead Temperature (soldering, 10 seconds) ............................................................ 300°C  
J & N* PACKAGE  
(Top View)  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
INV. INPUT  
N.I. INPUT  
E/A OUTPUT  
CLOCK  
+VREF  
+VIN  
OUTPUT B  
VC  
PWR GND  
OUTPUT A  
GROUND  
ILIM / S.D.  
RT  
CT  
RAMP  
SOFTSTART  
DW PACKAGE*  
(Top View)  
Note 1. Exceeding these ratings could cause damage to the device.  
THERMAL DATA  
3
2
1
20 19  
N PACKAGE:  
4
5
6
7
8
18  
17  
16  
15  
14  
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA  
DW PACKAGE:  
65°C/W  
95°C/W  
80°C/W  
80°C/W  
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA  
Q PACKAGE:  
9
10 11 12 13  
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA  
J PACKAGE:  
Q PACKAGE  
(Top View)  
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA  
L PACKAGE:  
3
2
1 20 19  
THERMAL RESISTANCE-JUNCTION TO CASE, θJC  
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA  
35°C/W  
4
5
6
7
8
18  
17  
16  
15  
14  
120°C/W  
Junction Temperature Calculation: TJ = TA + (P x θJA).  
The θJA numbers are guidelines for the thermal Dperformance of the device/pc-board  
system. All of the above assume no ambient airflow.  
9
10 11 12 13  
L PACKAGE  
(Top View)  
1. N.C.  
11. N.C.  
2. INV. INPUT  
3. N.I. INPUT  
4. E/A OUTPUT  
5. CLOCK  
6. N.C.  
12. ILIM / S.D.  
13. GROUND  
14. OUTPUT A  
15. PWR GND  
16. N.C.  
7. RT  
17. VC  
8. CT  
9. RAMP  
18. OUTPUT B  
19. +VIN  
10. SOFTSTART  
20. VREF  
*DW & N Packages: RoHS / Pb-free 100% Matte Tin Lead Finish  
Copyright © 1994  
Rev. 1.3a  
2

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