SG-BGA-6407 PDF预览

SG-BGA-6407

更新时间: 2025-07-19 19:53:51
品牌 Logo 应用领域
IRONWOOD /
页数 文件大小 规格书
4页 86K
描述
BGA Socket; gold plated wire elastomer

SG-BGA-6407 数据手册

 浏览型号SG-BGA-6407的Datasheet PDF文件第2页浏览型号SG-BGA-6407的Datasheet PDF文件第3页浏览型号SG-BGA-6407的Datasheet PDF文件第4页 
Top View  
GHz BGA Socket - Epoxy mount, solderless  
Features  
Directly mounts to target PCB (needs epoxy) .  
High speed, reliable Elastomer connection  
Minimum real estate required  
Compression plate distributes forces evenly  
Easily removable socket lid  
16.125mm  
Socket Lid: Black anodized 6061 Aluminum.  
Thickness = 2.5mm.  
1
2
A
A
Socket base: Black anodized 6061 Aluminum.  
Thickness = 5mm.  
Compression Plate: Black anodized 6061 Aluminum.  
Thickness = 2.5mm.  
3
Compression screw: Clear anodized 6061 Aluminum.  
Thickness = 5mm, Hex socket = 5mm.  
4
5
Side View  
(Section AA)  
16.125mm  
Elastomer: 20 micron dia gold plated brass  
filaments arranged symmetrically in a silicone  
rubber (63.5 degree angle).  
Thickness = 0.5mm.  
Socket lid screw: Socket head cap, Alloy steel with  
black oxide finish, 0-80 fine thread , 4.76mm long.  
6
1
4
6
3
Assembled  
8.0mm +  
IC thickness  
2
Epoxy  
Note: Alignment guide for positioning socket  
base to target PCB will be supplied.  
Customer's  
BGA IC  
5
Customer's Target PCB  
Scale: -  
All tolerances: ±0.125mm (unless stated  
otherwise). Materials and specifications  
are subject to change without notice.  
Status: Released  
Drawing: H. Hansen  
File: SG-BGA-7026 Dwg  
Rev: C  
SG-BGA-7026 Drawing  
© 2004 IRONWOOD ELECTRONICS, INC.  
PO BOX 21151 ST. PAUL, MN 55121  
Tele: (651) 452-8100  
Date: 10/20/04  
Modified: 07/30/14  
PAGE 1 OF 4  
www.ironwoodelectronics.com  

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