Datasheet > SF06Z2262BTLA

SF06Z2262BTLA

更新时间： 2024-04-09 18:39:05

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
10页	736K
描述
Anti-Sulfuration Thin Film Chip Resistor /SF.A Series 22600Ω, ±0.1%, ≦±5, 1/10W

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SF06Z2262BTLA 数据手册

Approval Sheet

SOLDERING CONDITION

The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260èC for 10

seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete

components on the reverse (mixed PCBs).

Surface Mount Resistors are tested for solderability at 235èC during 2 seconds within lead-free solder bath. The

test condition for no leaching is 260èC for 30 seconds. Typical examples of soldering profile and condition that

provide reliable joints without any damage are given in Fig 3. and Table 1.

Fig. 3 Infrared soldering profile for Chip Resistors

Table 1. Infrared soldering condition for Chip Resistors

Temperature Condition

Average ramp-up rate (217èC to 260èC)

Between 150 and 200èC

> 217èC

Exposure Time

Less than 3èC/second

Between 60-120 seconds

Between 60-150 seconds

260ºC +0/-5èC

Peak Temperature

Min. 30 seconds

Time within 245èC

Ramp-down rate (Peak to 217èC)

Time from 25èC to Peak

Less than 6èC/second

No greater than 480 seconds

Page 6 of 10

ASC_SFxxZ_A_V01

MAY - 2018

1...3 4 567 8 9 10

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