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SE370C712AFZT PDF预览

SE370C712AFZT

更新时间: 2024-10-01 13:02:15
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
50页 730K
描述
8-Bit Microcontroller Prototyping Device 28-JLCC

SE370C712AFZT 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:QFJ
包装说明:WINDOWED, CERAMIC, MO-087AA, LCC-28针数:28
Reach Compliance Code:not_compliantHTS代码:8542.31.00.01
风险等级:5.92Is Samacsys:N
具有ADC:NO地址总线宽度:
位大小:8CPU系列:TMS370
最大时钟频率:20 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:S-CQCC-J28长度:11.24 mm
I/O 线路数量:22端子数量:28
最高工作温度:105 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:WQCCJ封装等效代码:LDCC28,.5SQ
封装形状:SQUARE封装形式:CHIP CARRIER, WINDOW
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not QualifiedRAM(字节):256
ROM(单词):8192ROM可编程性:UVPROM
座面最大高度:4.57 mm速度:5 MHz
子类别:Microcontrollers最大压摆率:36 mA
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:J BEND端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:11.24 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

SE370C712AFZT 数据手册

 浏览型号SE370C712AFZT的Datasheet PDF文件第2页浏览型号SE370C712AFZT的Datasheet PDF文件第3页浏览型号SE370C712AFZT的Datasheet PDF文件第4页浏览型号SE370C712AFZT的Datasheet PDF文件第5页浏览型号SE370C712AFZT的Datasheet PDF文件第6页浏览型号SE370C712AFZT的Datasheet PDF文件第7页 
TMS370Cx1x  
8-BIT MICROCONTROLLER  
SPNS012F – MAY 1987 – REVISED FEBRUARY 1997  
JD AND N PACKAGES  
(TOP VIEW)  
CMOS/EEPROM/EPROM Technologies on  
a Single Device  
– Mask-ROM Devices for High-Volume  
Production  
– One-Time-Programmable (OTP) EPROM  
Devices for Low-Volume Production  
– Reprogrammable-EPROM Devices for  
Prototyping Purposes  
Internal System Memory Configurations  
– On-Chip Program Memory Versions  
– ROM: 2K, 4K, or 8K Bytes  
D6  
D7  
A7  
1
2
3
4
5
6
7
8
9
28 D3  
27 RESET  
26 D4  
V
25 SPISOMI  
24 SPICLK  
23 SPISIMO  
22 T1IC/CR  
21 T1PWM  
20 T1EVT  
19 MC  
CC  
XTAL2/CLKIN  
XTAL1  
A6  
A5  
A4  
A3 10  
A2 11  
18 INT3  
– EPROM: 8K Bytes  
V
12  
17 INT2  
SS  
A1 13  
16 INT1  
– Data EEPROM: 256 Bytes  
– Static RAM: 128 or 256 Bytes Usable as  
Registers  
A0 14  
15 D5  
FZ AND FN PACKAGES  
(TOP VIEW)  
Flexible Operating Features  
– Low-Power Modes: STANDBY and HALT  
– Commercial, Industrial, and Automotive  
Temperature Ranges  
4
3
2
1
28 27 26  
25  
– Clock Options  
5
XTAL2/CLKIN  
SPISOMI  
SPICLK  
SPISIMO  
T1IC/CR  
T1PWM  
T1EVT  
– Divide-by-1 (2 MHz–5 MHz SYSCLK)  
Phase-Locked Loop (PLL)  
– Divide-by-4 (0.5 MHz–5 MHz SYSCLK)  
6
XTAL1  
A6  
24  
23  
22  
21  
20  
19  
7
8
A5  
9
– Supply Voltage (V ) 5 V ±10%  
A4  
CC  
10  
11  
A3  
16-Bit General Purpose Timer  
– Software Configurable as  
a 16-Bit Event Counter, or  
A2  
MC  
12 13 14 15 16 1718  
a 16-Bit Pulse Accumulator, or  
a 16-Bit Input Capture Functions, or  
Two Compare Registers, or a  
Self-Contained PWM Function  
– Software Programmable Input Polarity  
– 8-Bit Prescaler, Providing a 24-Bit  
Real-Time Timer  
– Synchronous Master/Slave Operation  
TMS370 Series Compatibility  
– Register-to-Register Architecture  
– 128 or 256 General-Purpose Registers  
– 14 Powerful Addressing Modes  
– Instructions Upwardly Compatible With  
All TMS370 Devices  
CMOS/TTL Compatible I/O Pins/Packages  
– All Peripheral Function Pins Software  
Configurable for Digital I/O  
– 21 Bidirectional Pins, 1 Input Pin  
– 28-Pin Plastic and Ceramic DIP, or  
Leaded Chip Carrier (LCC) Packages  
Workstation/PC-Based Development  
System  
– C Compiler and C Source Debugger  
– Real-Time In-Circuit Emulation  
– Extensive Breakpoint/Trace Capability  
– Multi-Window User Interface  
On-Chip 24-Bit Watchdog Timer  
– EPROM/OTP Devices:  
– EPROM ’712A Standard Watchdog  
– EPROM ’712B Hard Watchdog  
– Mask-ROM Devices: Hard Watchdog,  
Simple Counter, or Standard Watchdog  
Flexible Interrupt Handling  
– Two Software Programmable Interrupt  
Levels  
– Global-and Individual-Interrupt Masking  
– Programmable Rising- or Falling-Edge  
Detect  
– Individual Interrupt Vectors  
Serial Peripheral Interface (SPI)  
– Variable-Length High-Speed Shift  
Register  
– Microcontroller Programmer  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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