SPICE MODEL: SDM03MT40
Lead-free Green
SDM03MT40/A
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
·
·
·
·
·
·
Low Forward Voltage Drop
A
Guard Ring Die Construction for Transient Protection
Ideal for low logic level applications
Low Capacitance
SOT-26
Dim Min Max Typ
C
B
TOP VIEW
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
Lead Free/RoHS Compliant (Note 3)
"Green" Device, Note 4 and 5
(See Note 6)
H
Mechanical Data
·
·
K
J
M
¾
¾
¾
¾
0.95
0.55
Case: SOT-26
F
L
D
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
Polarity: See Diagram
K
L
Leads: Matte Tin (Lead Free), Solderable per MIL-STD-202,
Method 208
M
a
·
Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
0°
8°
¾
All Dimensions in mm
SDM03MT40A
(KSK marking
code)
SDM03MT40
(KSR marking
code)
·
·
·
Marking: Marking Code & Date Code (See Page 3)
Marking Code: KSR, KSK
Weight: 0.016 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
VR(RMS)
IFM
RMS Reverse Voltage
28
30
V
Forward Continuous Current (Note 2)
mA
Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load
(JEDEDC method)
IFSM
200
mA
Pd
Power Dissipation (Note 2)
225
444
mW
°C/W
°C
RqJA
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
Tj, TSTG
-40 to +125
@ TA = 25°C unless otherwise specified
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 1)
Forward Voltage Drop (Note 1)
Leakage Current (Note 1)
Symbol
V(BR)R
VF
Min
40
¾
Typ
¾
¾
¾
2
Max
¾
Unit
V
Test Condition
IR = 10uA
IF = 1mA
370
1
mV
mA
pF
IR
VR = 10V
¾
CT
VR = 1V f = 1.0 MHz
Total Capacitance
¾
¾
Notes: 1. Short duration test pulse to minimize self-heating effect.
2. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
6. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
DS30372 Rev. 9 - 2
1 of 3
SDM03MT40/A
www.diodes.com
ã Diodes Incorporated