Datasheet > SAA5361HL/M1/1651

SAA5361HL/M1/1651

更新时间： 2022-05-16 23:30:24

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
28页	155K
描述
SAA5361HL/M1/1651 TSG0537/M1

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Philips Semiconductors

Product speciﬁcation

Multi page intelligent teletext decoder

SAA5360; SAA5361

CONTENTS

PACKAGE OUTLINE

SOLDERING

FEATURES

14.1

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

14.2

14.3

14.4

14.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

PINNING

6.1

6.2

Type SAA5360

Type SAA5361

DATA SHEET STATUS

DEFINITIONS

COMMANDS AND CHARACTER SETS

DISCLAIMERS

PURCHASE OF PHILIPS I²C COMPONENTS

7.1

7.2

High-level command interface

Character sets

LIMITING VALUES

THERMAL CHARACTERISTICS

QUALITY AND RELIABILITY

CHARACTERISTICS

APPLICATION INFORMATION

12.1

EMC guidelines

12.2

12.3

Application diagram

Application notes

12.3.1

12.3.2

External data memory access

Symbol explanations

2005 Mar 09

123 4 5 6 7...28

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