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SA868/CG/DP1 PDF预览

SA868/CG/DP1

更新时间: 2024-09-25 19:26:39
品牌 Logo 应用领域
美高森美 - MICROSEMI 光电二极管
页数 文件大小 规格书
15页 979K
描述
PULSE, WAVEFORM GENERATION, PDIP24, PLASTIC, DIP-24

SA868/CG/DP1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP24,.6
针数:24Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.91模拟集成电路 - 其他类型:PULSE
JESD-30 代码:R-PDIP-T24JESD-609代码:e0
功能数量:1端子数量:24
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP24,.6封装形状:RECTANGULAR
封装形式:IN-LINE电源:5 V
认证状态:Not Qualified座面最大高度:5.08 mm
子类别:Motion Control Electronics最大供电电流 (Isup):5 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:15.24 mm
Base Number Matches:1

SA868/CG/DP1 数据手册

 浏览型号SA868/CG/DP1的Datasheet PDF文件第2页浏览型号SA868/CG/DP1的Datasheet PDF文件第3页浏览型号SA868/CG/DP1的Datasheet PDF文件第4页浏览型号SA868/CG/DP1的Datasheet PDF文件第5页浏览型号SA868/CG/DP1的Datasheet PDF文件第6页浏览型号SA868/CG/DP1的Datasheet PDF文件第7页 
This product is obsolete.  
This information is available for your  
convenience only.  
For more information on  
Zarlink’s obsolete products and  
replacement product lists, please visit  
http://products.zarlink.com/obsolete_products/  

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