Datasheet > S71WS128NC0

S71WS128NC0

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
飞索 - SPANSION		/
页数	文件大小	规格书
13页	334K
描述
Stacked Multi-Chip Product (MCP)

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S71WS128NC0 数据手册

S71WS-N

Stacked Multi-Chip Product (MCP)

1.8 Volt-only Simultaneous Read/Write,

Burst-mode Flash Memory with CellularRAM^™

S71WS-N Cover Sheet

Data Sheet (Advance Information)

Notice to Readers: This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

Publication Number S71WS-N_00

Revision A

Amendment 6

Issue Date July 19, 2006

12 3 4 5 6 7...13

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型号	品牌	描述	获取价格	数据表
S71WS128NC0BAWA20	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, FBGA-84	获取价格
S71WS128NC0BAWA23	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, FBGA-84	获取价格
S71WS128NC0BAWA30	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, FBGA-84	获取价格
S71WS128NC0BAWA32	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, FBGA-84	获取价格
S71WS128NC0BAWA60	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, FBGA-84	获取价格
S71WS128NC0BAWA62	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, FBGA-84	获取价格