Datasheet > S71WS128NB0BAWAK2

S71WS128NB0BAWAK2

更新时间： 2024-02-11 00:42:51

品牌	Logo	应用领域
飞索 - SPANSION		静态存储器内存集成电路
页数	文件大小	规格书
13页	332K
描述
Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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S71WS128NB0BAWAK2 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	TFBGA, BGA84,10X12,32
针数：	84	Reach Compliance Code：	compliant
HTS代码：	8542.32.00.71	风险等级：	5.82
Is Samacsys：	N	最长访问时间：	80 ns
其他特性：	PSRAM IS ORGANIZED AS 2M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	JESD-30 代码：	R-PBGA-B84
JESD-609代码：	e1	长度：	11.6 mm
内存密度：	134217728 bit	内存集成电路类型：	MEMORY CIRCUIT
内存宽度：	16	混合内存类型：	FLASH+PSRAM
湿度敏感等级：	3	功能数量：	1
端子数量：	84	字数：	8388608 words
字数代码：	8000000	工作模式：	ASYNCHRONOUS
最高工作温度：	85 °C	最低工作温度：	-25 °C
组织：	8MX16	封装主体材料：	PLASTIC/EPOXY
封装代码：	TFBGA	封装等效代码：	BGA84,10X12,32
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260	电源：	1.8 V
认证状态：	Not Qualified	座面最大高度：	1.2 mm
最大待机电流：	0.00007 A	子类别：	Other Memory ICs
最大压摆率：	0.054 mA	最大供电电压 (Vsup)：	1.95 V
最小供电电压 (Vsup)：	1.7 V	标称供电电压 (Vsup)：	1.8 V
表面贴装：	YES	技术：	CMOS
温度等级：	OTHER	端子面层：	TIN SILVER COPPER
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	40
宽度：	8 mm	Base Number Matches：	1

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D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )

6. Revision History

Section

Description

Revision A (February 1, 2004)

Initial release.

Revision A1 (February 9, 2005)

Updated document to include Burst Speed of 66 MHz

Updated Publication Number

Global

Revision A2 (March 31, 2005)

Global

Updated Product Selector Guide and Ordering Information tables

Revision A3 (May 2, 2005)

Added 80 MHz speed options to:

Product Selector Guide

Global

Ordering Information table

Valid Combination table

Revision A4 (August 25, 2005)

Global

Replaced module cellRAM_00_A0 with cellRAM_03 and cellRAM_04

Revision A5 (February 7, 2006)

Updated Product Selector Guide with new options

Updated the Ordering Part Number table

Updated the Valid Combinations table

Removed the Look-ahead Diagram

Global

Revision A6 (July 19, 2006)

Reformatted document to new template

Global

Added reference to 32 Mb CellRAM module

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as

contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal

operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under

the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,

the prior authorization by the respective government entity will be required for export of those products.

Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under

development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this

document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,

merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any

damages of any kind arising out of the use of the information in this document.

thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

July 19, 2006 S71WS-N_00_A6

S71WS-N

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与S71WS128NB0BAWAK2相关器件

型号	品牌	描述	获取价格	数据表
S71WS128NB0BAWAK3	SPANSION	Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE	获取价格
S71WS128NB0BAWAM0	SPANSION	Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE	获取价格
S71WS128NB0BAWAN2	SPANSION	Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE	获取价格
S71WS128NB0BAWAP	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	获取价格
S71WS128NB0BFWAH	SPANSION	Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	获取价格
S71WS128NB0BFWAH0	SPANSION	Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE,	获取价格

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