是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA56,8X8,32 | Reach Compliance Code: | compliant |
风险等级: | 5.83 | 最长访问时间: | 70 ns |
JESD-30 代码: | S-PBGA-B56 | 内存集成电路类型: | MEMORY CIRCUIT |
混合内存类型: | FLASH+SRAM | 端子数量: | 56 |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA56,8X8,32 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 3 V |
认证状态: | Not Qualified | 最大待机电流: | 0.000005 A |
子类别: | Other Memory ICs | 最大压摆率: | 0.07 mA |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
S71PL032J04BFW0Z0 | SPANSION | Based MCPs |
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S71PL032J04BFW0Z2 | SPANSION | Based MCPs |
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S71PL032J04BFW0Z3 | SPANSION | Based MCPs |
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S71PL032J04BFW9Z0 | SPANSION | Based MCPs |
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S71PL032J04BFW9Z2 | SPANSION | Based MCPs |
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S71PL032J04BFW9Z3 | SPANSION | Based MCPs |
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