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S29PL127J60TFW130 PDF预览

S29PL127J60TFW130

更新时间: 2024-01-05 03:49:48
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 光电二极管
页数 文件大小 规格书
101页 7830K
描述
Flash, 8MX16, 60ns, PDSO56, TSOP-56

S29PL127J60TFW130 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:TSSOP, TSSOP56,.8,20Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.26最长访问时间:60 ns
其他特性:TOP AND BOTTOM BOOT BLOCK启动块:BOTTOM/TOP
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PDSO-G56
JESD-609代码:e3长度:18.4 mm
内存密度:134217728 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
功能数量:1部门数/规模:16,254
端子数量:56字数:8388608 words
字数代码:8000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:8MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP56,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小:8 words并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:4K,32K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.07 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:MATTE TIN端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:14 mm
Base Number Matches:1

S29PL127J60TFW130 数据手册

 浏览型号S29PL127J60TFW130的Datasheet PDF文件第1页浏览型号S29PL127J60TFW130的Datasheet PDF文件第2页浏览型号S29PL127J60TFW130的Datasheet PDF文件第3页浏览型号S29PL127J60TFW130的Datasheet PDF文件第5页浏览型号S29PL127J60TFW130的Datasheet PDF文件第6页浏览型号S29PL127J60TFW130的Datasheet PDF文件第7页 
S29PL-J  
1. General Description  
The PL127J/PL129J/PL064J/PL032J is a 128/128/64/32 Mbit, 3.0 volt-only Page Mode and Simultaneous Read/Write Flash  
memory device organized as 8/8/4/2 Mwords. The devices are offered in the following packages:  
– 11 mm 8 mm, 80-ball Fine-pitch BGA standalone (PL127J)  
– 8 mm 11.6 mm, 64-ball Fine-pitch BGA multi-chip compatible (PL127J)  
– 8.15 mm 6.15 mm, 48-ball Fine-pitch BGA standalone (PL064J/PL032J)  
– 7 mm 9 mm, 56-ball Fine-pitch BGA multi-chip compatible (PL064J and PL032J)  
– 20 mm 14 mm, 56-pin TSOP (PL127J)  
The word-wide data (x16) appears on DQ15-DQ0. This device can be programmed in-system or in standard EPROM programmers.  
A 12.0 V VPP is not required for write or erase operations.  
2. Simultaneous Read/Write Operation with Zero Latency  
The Simultaneous Read/Write architecture provides simultaneous operation by dividing the memory space into 4 banks, which  
can be considered to be four separate memory arrays as far as certain operations are concerned. The device can improve overall  
system performance by allowing a host system to program or erase in one bank, then immediately and simultaneously read from  
another bank with zero latency (with two simultaneous operations operating at any one time). This releases the system from waiting  
for the completion of a program or erase operation, greatly improving system performance.  
The device can be organized in both top and bottom sector configurations. The banks are organized as follows:  
Bank  
PL127J Sectors  
16 Mbit (4 Kw 8 and 32 Kw 31)  
48 Mbit (32 Kw 96)  
48 Mbit (32 Kw 96)  
16 Mbit (4 Kw x 8 and 32 Kw 31)  
PL064J Sectors  
8 Mbit (4 Kw 8 and 32 Kw 15)  
24 Mbit (32 Kw 48)  
24 Mbit (32 Kw 48)  
8 Mbit (4 Kw 8 and 32 Kw 15)  
PL032J Sectors  
4 Mbit (4 Kw 8 and 32 Kw 7)  
12 Mbit (32 Kw 24)  
12 Mbit (32 Kw 24)  
4 Mbit (4 Kw 8 and 32 Kw 7)  
A
B
C
D
Bank  
1A  
PL129J Sectors  
CE# Control  
CE1#  
16 Mbit (4 Kw 8 and 32 Kw 31)  
48 Mbit (32 Kw 96)  
1B  
CE1#  
2A  
48 Mbit (32 Kw 96)  
CE2#  
2B  
16 Mbit (4 Kw 8 and 32 Kw 31)  
CE2#  
Document Number: 002-00615 Rev. *B  
Page 4 of 101  

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