D a t a S h e e t
18.4 Revision A3 (June 21, 2005)
Global
Update from Preliminary status to full Data Sheet.
Ordering Information
Added two Model Numbers.
Valid Combinations Table
Updated table with new Model Numbers and Package Types.
18.5 Revision A4 (May 22, 2006)
AC Characteristics
Added tSR/W parameter to read and erase/program operations tables. Added back-to-back read/write cycle
timing diagram. Changed maximum value for tDF and tFLQZ
.
18.6 Revision A5 (June 22, 2006)
Connection Diagrams
Changed inputs on pins 1 and 2 of SO package.
Read Operations Timings figure
Connected end of tRC period to start of tOH period.
Erase/Program Operations table
Changed tBUSY to a maximum specification.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2004-2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
June 22, 2006 S29AL004D_00_A5
S29AL004D
45
5秒后页面跳转
深入解析CS8416引脚说明、参数、技术特点
TPA3116D2功放芯片参数详解、引脚说明
移位寄存器74HC165引脚说明、驱动程序示例解读
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
