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RT6212AHGJ6F PDF预览

RT6212AHGJ6F

更新时间: 2022-02-26 11:31:42
品牌 Logo 应用领域
立锜 - RICHTEK /
页数 文件大小 规格书
18页 1057K
描述
Step-Down Converter

RT6212AHGJ6F 数据手册

 浏览型号RT6212AHGJ6F的Datasheet PDF文件第2页浏览型号RT6212AHGJ6F的Datasheet PDF文件第3页浏览型号RT6212AHGJ6F的Datasheet PDF文件第4页浏览型号RT6212AHGJ6F的Datasheet PDF文件第6页浏览型号RT6212AHGJ6F的Datasheet PDF文件第7页浏览型号RT6212AHGJ6F的Datasheet PDF文件第8页 
RT6212A/B  
Parameter  
Symbol  
VEN_F  
Test Conditions  
Min  
Typ  
Max  
Unit  
VEN falling, RT6212A/BHRGJ6F  
1.11  
1.21  
1.31  
Feedback Voltage  
4.5V ≤ VIN ≤ 18V,  
RT6212A/BHGJ6F  
0.788  
0.8  
0.812  
Feedback Reference Voltage  
VREF  
V
4.5V ≤ VIN ≤ 18V,  
RT6212A/BHRGJ6F  
0.753 0.765 0.777  
Internal MOSFET  
High-Side On-Resistance  
Low-Side On-Resistance  
Current Limit  
RDS(ON)_H VBOOT VLX = 4.8V  
--  
--  
163  
86  
--  
--  
m  
RDS(ON)_L  
High-Side Switch Current Limit ILIM_H  
--  
5.8  
3.3  
--  
--  
A
Low-Side Switch Valley Current  
ILIM_L  
2.6  
Limit  
Switching Frequency  
Switching Frequency  
On-Time Timer Control  
Minimum On-Time  
fSW  
400  
500  
640  
kHz  
ns  
tON_MIN  
35  
60  
85  
Minimum Off-Time  
tOFF_MIN  
185  
240  
315  
Output Under-Voltage and Over-Voltage Protections  
OVP Trip Threshold  
OVP detect  
--  
--  
125  
10  
50  
10  
5
--  
--  
%
OVP Propagation Delay  
µs  
UVP detect  
Hysteresis  
45  
--  
55  
--  
UVP Trip Threshold  
%
UVP Propagation Delay  
Thermal Shutdown  
--  
--  
µs  
Thermal Shutdown Threshold  
TSD  
--  
--  
150  
20  
--  
--  
°C  
Thermal Shutdown Hysteresis TSD  
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are  
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the  
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect  
device reliability.  
Note 2. JA is measured under natural convection (still air) at T = 25C with the component mounted on a high  
A
effective-thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard. The first layer is  
filled with copper. JA is measured at the lead of the package.  
Note 3. Devices are ESD sensitive. Handling precaution recommended.  
Note 4. The device is not guaranteed to function outside its operating conditions.  
Copyright © 2017 Richtek Technology Corporation. All rights reserved.  
is a registered trademark of Richtek Technology Corporation.  
DS6212A/B-05 July 2017  
www.richtek.com  
5

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