Datasheet > RT15N0R5G500CG

RT15N0R5G500CG

更新时间： 2022-05-14 22:03:16

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
11页	3169K
描述
High Q and low ESR performance at high frequency

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RT15N0R5G500CG 数据手册

Multilayer Ceramic Capacitors

AEC-Q200

Approval Sheet

No.

AEC-Q200 Test Condition

Requirements

Test Item

10. Resistance to

Solvents

* Temperature: 25±5°C

* Time: 3+0.5/-0 min.

* No remarkable damage.

* Cap.: within the specified tolerance.

MIL-STD-202

Method 215

* Solvent: Iso-propyl alcohol.

* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.

* No remarkable damage.

11. Mechanical Shock * Peak value: 1500g’s.

MIL-STD-202

* Wave: 1/2 sine.

* Cap.: within the specified tolerance.

Method 213

* Velocity: 15.4 ft/sec

* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

* Three shocks in each direction should be applied * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.

along

3 mutually perpendicular axes of the test specimen

(18 shocks)

12.

13.

Vibration

* Vibration frequency: 10~2000 Hz/min.

(5g’s for 20 min)

* No remarkable damage.

MIL-STD-202

Method 204

* Cap.: within the specified tolerance.

* Total amplitude: 1.5mm

* Q. value: NPO:Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.

* No remarkable damage.

* 12 cycles each of 3 orientations (36 times)

* Solder temperature: 270±5°C

* Dipping time: 10±1 sec

Resistance to

Soldering Heat

MIL-STD-202

Method 210

* Cap change: NPO: within ±2.5% or 0.25pF whichever is larger

* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.

* Measurement to be made after keeping at room

temp. for 24±2 hrs.

14 Thermal Shock

MIL-STD-202

* Conduct 300 cycles according to the temperatures * No remarkable damage.

and time.

* Cap change：NPO: within ±2.5% or 0.25pF whichever is larger.

Method 107

* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.

Step

Temp. (°C)

-55°C +0/-3

+125°C +3/-0

Time (min.)

15±3

* Max. transfer time: 20 sec.

* Measurement to be made after keeping at room

temp. for 24±2 hrs.

15.

ESD

Per AEC-Q200-002

* No remarkable damage.

AEC-Q200-002

* Cap.: within the specified tolerance.

* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.

All terminations shall exhibit a continuous solder coating free from

16. Solderability

J-STD-002

* Condition A

Un-mounted chips 4hrs / 155°C*dry then completely defects from a minimum of 95% of the critical surface area of any individual

JESD22-B102E

immersed for 5 0.5 sec in solder bath at 245 5°C.

* Condition B

termination.

Un-mounted chips steam 8 hrs then completely

immersed for 10 1sec in solder bath at 220+5/-0°C.

* Condition C

Un-mounted chips steam 8 hrs then completely

immersed for 10 1 sec. in solder bath at 260+0/-5°C.

Page 7 of 11

ASC_Microwave_AECQ200_(RT)

May. 2019

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