Datasheet > RM3940J-3.3XQML

RM3940J-3.3XQML

更新时间： 2024-01-21 19:30:10

品牌	Logo	应用领域
德州仪器 - TI		输出元件调节器
页数	文件大小	规格书
15页	375K
描述
3.3V FIXED POSITIVE LDO REGULATOR, 0.2V DROPOUT, CDIP16, CERAMIC, DIP-16

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RM3940J-3.3XQML 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	DIP,	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.92	最大回动电压 1：	0.2 V
最大输入电压：	5.5 V	最小输入电压：	4.5 V
JESD-30 代码：	R-GDIP-T16	JESD-609代码：	e0
湿度敏感等级：	1	功能数量：	1
端子数量：	16	工作温度TJ-Max：	125 °C
工作温度TJ-Min：	-40 °C	最大输出电流 1：	1 A
最大输出电压 1：	3.47 V	最小输出电压 1：	3.13 V
标称输出电压 1：	3.3 V	封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP	封装形状：	RECTANGULAR
封装形式：	IN-LINE	认证状态：	Not Qualified
调节器类型：	FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR	筛选级别：	MIL-PRF-38535 Class Q
座面最大高度：	5.08 mm	表面贴装：	NO
端子面层：	Tin/Lead (Sn63Pb37)	端子形式：	THROUGH-HOLE
端子节距：	2.54 mm	端子位置：	DUAL
宽度：	7.62 mm	Base Number Matches：	1

RM3940J-3.3XQML 数据手册

As a design aid, Figure 4 shows the maximum allowable

power dissipation compared to ambient temperature for the

TO-263 device (assuming θ_(J−A)is 35˚C/W and the maxi-

mum junction temperature is 125˚C).

Application Hints (Continued)

If a manufactured heatsink is to be selected, the value of

heatsink-to-ambient thermal resistance, θ_(H−A), must first be

calculated:

θ_(H−A)θ_(J−A)− θ_(C−H)− θ_(J−C)

Where: θ_(J−C)is defined as the thermal resistance from

the junction to the surface of the case. A

value of 4˚C/W can be assumed for θ_(J−C)

for this calculation.

θ_(C−H)

is defined as the thermal resistance be-

tween the case and the surface of the heat-

sink. The value of θ_(C−H)will vary from

about 1.5˚C/W to about 2.5˚C/W (depend-

ing on method of attachment, insulator,

etc.). If the exact value is unknown, 2˚C/W

should be assumed for θ_(C−H)

DS012080-8

When a value for θ_(H−A)is found using the equation shown,

a heatsink must be selected that has a value that is less than

or equal to this number.

FIGURE 4. Maximum Power Dissipation vs T_AMBfor

the TO-263 Package

Figure 5 and Figure 6 show the information for the SOT-223

package. Figure 6 assumes a θ_(J−A)of 74˚C/W for 1 ounce

copper and 51˚C/W for 2 ounce copper and a maximum

junction temperature of 125˚C.

θ_(H−A)is specified numerically by the heatsink manufacturer

in the catalog, or shown in a curve that plots temperature rise

vs power dissipation for the heatsink.

HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS

Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a

copper plane on the PCB and the PCB itself as a heatsink.

To optimize the heat sinking ability of the plane and PCB,

solder the tab of the package to the plane.

Figure 3 shows for the TO-263 the measured values of θ_(J−A)

for different copper area sizes using a typical PCB with 1

ounce copper and no solder mask over the copper area used

for heatsinking.

DS012080-11

FIGURE 5. θ_(J−A)vs Copper (2 ounce) Area for the

SOT-223 Package

DS012080-7

FIGURE 3. θ_(J−A)vs Copper (1 ounce) Area for the

TO-263 Package

As shown in the figure, increasing the copper area beyond 1

square inch produces very little improvement. It should also

be observed that the minimum value of θ_(J−A)for the TO-263

package mounted to a PCB is 32˚C/W.

DS012080-12

FIGURE 6. Maximum Power Dissipation vs T_AMBfor

the SOT-223 Package

Please see AN1028 for power enhancement techniques to

be used with the SOT-223 package.

www.national.com

1...4 5 678 9 10...15

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RM3B	SANKEN	获取价格	Rectifier Diodes

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