CHIP RESISTOR
电阻温度系数
阻值范围
Temperature Coefficient of Resistance
Resistance Range
型号
Type
T.C.R(ppm/℃)
代号 Code
±
1%
±3%
±5%
0.05Ω≤
R
<
0.1
Ω
±
700
300
R
B
0402
0603
±
0.1Ω≤
R
<
0.5
Ω
0.5Ω≤
R
<1Ω
±
200
800
W
Q
0.02Ω≤
R
<
0.05
Ω
±
0.05Ω≤
R
<
0.1
Ω
±300
±200
±1200
±600
B
0.1Ω≤
0.01Ω≤
0.015Ω≤
0.025
0.05Ω≤
0.068Ω≤
R<1Ω
W
R
<
0.015
0.025
0.05
0.068
Ω
Z
R
<
Ω
A
U
J
0805
Ω
≤
R
<
Ω
±
400
150
R
<
Ω
±
R
<
1
Ω
±100
±600
±400
±150
±100
K
0.01Ω≤
R
R
<
<
0.02
Ω
A
U
0.02Ω≤
0.05
Ω
1206
1210
0.05Ω≤R<0.068
J
K
A
0.068Ω≤
R
<1Ω
0.01
0.02Ω≤
0.05
Ω
≤
R
<
0.02
0.05
Ω
±600
R
<
Ω
±
400
100
U
K
Ω
≤
R
<1Ω
±
0.01Ω≤
R
R
<
0.02
Ω
Ω
±
600
A
U
K
0.02Ω≤
<0.05
±
400
100
2010
2512
0.05Ω≤R<1Ω
±
0.01Ω≤
R
R
<
0.02
Ω
Ω
±
600
100
A
K
0.02Ω≤
<0.05
±
0.05Ω≤
R<1Ω
±100
K
标 准
项目
测试方法(IEC60115-1)
Specifications
Item
Test Methods (IEC60115-1)
IEC 60115-1 4.17
245℃±5℃锡槽,保持3s±0.3s.
Lead-free solder bath at 245℃±5℃ for 3s±0.3s.
可焊面积≥95%
95% Cover Min
可焊性
Solderability
耐焊接热
无可见损伤
IEC 60115-1 4.18
Resistance to
Soldering Heat
No mechanical damage
≤±(1.0%R+0.5m
270℃±5℃锡槽,保持10s±1s.
Lead-free solder bath at 270℃±5℃ for 10s±1s.
△
R
Ω)
4