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RK80532PE067512/SL6QA PDF预览

RK80532PE067512/SL6QA

更新时间: 2024-01-08 16:41:04
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
85页 1750K
描述
RISC Microprocessor, 32-Bit, 2660MHz, CMOS, CPGA478

RK80532PE067512/SL6QA 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:SPGA, PGA478,26X26,50Reach Compliance Code:unknown
风险等级:5.84Is Samacsys:N
位大小:32JESD-30 代码:S-XPGA-P478
端子数量:478封装主体材料:CERAMIC
封装代码:SPGA封装等效代码:PGA478,26X26,50
封装形状:SQUARE封装形式:GRID ARRAY, SHRINK PITCH
电源:1.5 V认证状态:Not Qualified
速度:2660 MHz子类别:Microprocessors
标称供电电压:1.5 V表面贴装:NO
技术:CMOS端子形式:PIN/PEG
端子节距:1.27 mm端子位置:PERPENDICULAR
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

RK80532PE067512/SL6QA 数据手册

 浏览型号RK80532PE067512/SL6QA的Datasheet PDF文件第1页浏览型号RK80532PE067512/SL6QA的Datasheet PDF文件第2页浏览型号RK80532PE067512/SL6QA的Datasheet PDF文件第4页浏览型号RK80532PE067512/SL6QA的Datasheet PDF文件第5页浏览型号RK80532PE067512/SL6QA的Datasheet PDF文件第6页浏览型号RK80532PE067512/SL6QA的Datasheet PDF文件第7页 
Contents  
1
Introduction..................................................................................................................9  
1.1  
Terminology.........................................................................................................11  
1.1.1 Processor Packaging Terminology.........................................................11  
References..........................................................................................................12  
1.2  
2
Electrical Specifications........................................................................................15  
2.1  
2.2  
2.3  
System Bus and GTLREF...................................................................................15  
Power and Ground Pins ......................................................................................15  
Decoupling Guidelines ........................................................................................16  
2.3.1 VCC Decoupling.....................................................................................16  
2.3.2 System Bus AGTL+ Decoupling.............................................................16  
Voltage Identification...........................................................................................16  
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18  
Reserved, Unused Pins, and TESTHI[12:0]........................................................20  
System Bus Signal Groups .................................................................................21  
Asynchronous GTL+ Signals...............................................................................22  
Test Access Port (TAP) Connection....................................................................22  
System Bus Frequency Select Signals (BSEL[1:0])............................................22  
Maximum Ratings................................................................................................23  
Processor DC Specifications...............................................................................23  
AGTL+ System Bus Specifications .....................................................................35  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
2.10  
2.11  
2.12  
3
Package Mechanical Specifications.................................................................37  
3.1  
3.2  
3.3  
3.4  
3.5  
Package Load Specifications ..............................................................................40  
Processor Insertion Specifications ......................................................................41  
Processor Mass Specifications ...........................................................................41  
Processor Materials.............................................................................................41  
Processor Markings.............................................................................................42  
4
5
Pin Lists and Signal Descriptions.....................................................................45  
4.1  
4.2  
Processor Pin Assignments ................................................................................45  
Signal Descriptions..............................................................................................58  
Thermal Specifications and Design Considerations.................................67  
5.1  
Processor Thermal Specifications.......................................................................68  
5.1.1 Thermal Specifications...........................................................................68  
5.1.2 Thermal Metrology .................................................................................70  
5.1.2.1 Processor Case Temperature Measurement ............................70  
6
Features .......................................................................................................................71  
6.1  
6.2  
Power-On Configuration Options ........................................................................71  
Clock Control and Low Power States..................................................................71  
6.2.1 Normal State—State 1 ...........................................................................71  
6.2.2 AutoHALT Powerdown State—State 2...................................................72  
6.2.3 Stop-Grant State—State 3 .....................................................................73  
6.2.4 HALT/Grant Snoop State—State 4 ........................................................73  
6.2.5 Sleep State—State 5..............................................................................74  
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet  
3

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