Datasheet > RH18G1R6B251

RH18G1R6B251

更新时间： 2024-04-09 18:56:34

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
13页	4191K
描述
0603, X8G, 1.6pF, 250Vdc

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RH18G1R6B251 数据手册

Multilayer Ceramic Capacitors

Approval Sheet

10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item

Test Conditions

Requirements

1. Visual and

Mechanical

---

* No remarkable defect.

* Dimensions to conform to individual specification sheet.

2. Capacitance

3. Q/ D.F.

(Dissipation

Factor)

* Test temp.: Room Temperature.

1.0±0.2Vrms, 1MHz±10%

* Shall not exceed the limits given in the detailed spec.

* Q≥800+20C

* To apply voltage:

4. Dielectric

Strength

* No evidence of damage or flash over during test.

200V ~ 250V : 200% of rated voltage.

* Duration: 1 to 5 sec.

* Charge & discharge current less than 50mA.

5. Insulation

Resistance

* Test temp.: Room Temperature.

≥10GΩ or RxC≥100Ω-F whichever is smaller

* Capacitance change: within ±30ppm/°C;

≤100V : To apply rated voltage for max. 120 sec.

≥200V :To apply rated voltage (500V max.) for 60 sec.

With no electrical load.

6. Temperature

Coefficient

Operating temperature: -55~150°C at 25°C

7. Adhesive

Strength of

Termination

* Pressurizing force：

0402 to 0603: 5N

>0603: 10N

* No remarkable damage or removal of the terminations.

* Test time: 10±1 sec.

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

8. Vibration

Resistance

* No remarkable damage.

* Cap change and Q/D.F.: To meet initial spec.

* Test time: 6 hrs. (Two hrs each in three mutually

perpendicular directions.)

* Cap./DF(Q) Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

9. Solderability

10. Bending Test

* Solder temperature: 235±5°C

* Dipping time: 2±0.5 sec.

95% min. coverage of all metalized area.

* The middle part of substrate shall be pressurized by means

of the pressurizing rod at a rate of about 1 mm per second until

the deflection becomes 1 mm and then the pressure shall be

maintained for 5±1 sec.

* No remarkable damage.

* Cap change: within ±5.0% or ±0.5pF whichever is larger.

(This capacitance change means the change of capacitance under

specified flexure of substrate from the capacitance measured before

the test.)

* Measurement to be made after keeping at room temp. for

24±2 hrs.

* Solder temperature: 260±5°C

11. Resistance to

Soldering Heat

* No remarkable damage.

* Dipping time: 10±1 sec

* Cap change: within ±2.5% or ±0.25pF whichever is larger.

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

* 25% max. leaching on each edge.

* Preheating: 120 to 150°C for 1 minute before imme rse the

capacitor in a eutectic solder.

* Cap. / DF(Q) / I.R. Measurement to be made after de-aging

at 150°C for 1hr then set for 24±2 hrs at room temp .

* "Room condition" Temperature: 15 to 35°C, Relativ e humidity: 25 to 75%, Atmospheric pressure: 86 to 106kPa.

Page 9 of 13

ASC_Microwave_High_Reliability_RH

Feb. 2023

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