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RH15G0R5G251CG PDF预览

RH15G0R5G251CG

更新时间: 2022-05-14 22:02:50
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
12页 4011K
描述
High Q and low ESR performance at high frequency

RH15G0R5G251CG 数据手册

 浏览型号RH15G0R5G251CG的Datasheet PDF文件第6页浏览型号RH15G0R5G251CG的Datasheet PDF文件第7页浏览型号RH15G0R5G251CG的Datasheet PDF文件第8页浏览型号RH15G0R5G251CG的Datasheet PDF文件第9页浏览型号RH15G0R5G251CG的Datasheet PDF文件第10页浏览型号RH15G0R5G251CG的Datasheet PDF文件第11页 
Multilayer Ceramic Capacitors  
Approval Sheet  
Constructions  
No.  
1
2
3
4
5
Name  
X8G  
Ceramic material  
Inner electrode  
Hi-Q dielectric ceramic  
Cu  
Cu  
Inner layer  
Termination  
Middle layer  
Outer layer  
Ni  
Sn (Matt)  
Fig. 17 The construction of MLCC  
Storage and handling conditions  
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.  
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life  
extension is needed.  
Cautions:  
a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.  
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,  
chlorine, ammonia gas etc.)  
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low  
reliability.  
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by  
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under  
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.  
Recommended soldering conditions  
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable  
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and  
concentration of N2 within oven are recommended.  
Fig. 18 Recommended reflow soldering profile for SMT process  
with SnAgCu series solder paste.  
Fig. 19 Recommended wave soldering profile for SMT process  
with SnAgCu series solder.  
Page 12 of 12  
ASC_Microwave_High_ Reliability_(RH)_023B  
Jun. 2019  

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