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RCLAMP2504P_08 PDF预览

RCLAMP2504P_08

更新时间: 2024-09-28 06:07:15
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商升特 - SEMTECH 电视
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11页 202K
描述
RailClamp® 2.5V & 3.3V TVS Arrays

RCLAMP2504P_08 数据手册

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RClamp2504P & RClamp3304P  
RailClamp®  
2.5V & 3.3V TVS Arrays  
PROTECTION PRODUCTS - RailClamp®  
Features  
Description  
RailClamp® is a low capacitance TVS array designed to  
protect high speed data interfaces. This series has been  
specifically designed to protect sensitive components  
which are connected to data and transmission lines from  
overvoltage caused by ESD (electrostatic discharge), CDE  
(Cable Discharge Events), and EFT (electrical fast tran-  
sients).  
‹ Transient protection for high-speed data lines to  
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  
IEC 61000-4-4 (EFT) 40A (5/50ns)  
‹ Array of surge rated diodes with internal TVS Diode  
‹ Small package saves board space  
‹ Protects up to four I/O lines  
‹ Low capacitance (<0.8pF) for high-speed interfaces  
‹ Minimal insertion loss to 3.0GHz  
The monolithic design incorporates surge rated, low  
capacitance steering diodes and a TVS diode in a single  
package. Each line has a maximum capacitance of  
< 0.8pF to ground. The capacitance of each line is well  
matched for consistant signal balance. This device is  
optimized for ESD protection of portable electronics. It  
may be used to meet the ESD immunity requirements  
of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact  
discharge).  
The RClampTM2504P and RClampTM3304P are con-  
structed using Semtech’s proprietary EPD process  
technology. The EPD process provides low standoff  
voltages with significant reductions in leakage current  
and capacitance over silicon-avalanche diode pro-  
cesses. They feature a true operating voltage of 2.5  
volts and 3.3 volts for superior protection.  
‹ Low operating voltage: 2.5V and 3.3V  
‹ Low leakage current and clamping voltage  
‹ Solid-state silicon-avalanche technology  
Mechanical Characteristics  
‹ SLP1616P6 package  
‹ RoHS/WEEE Compliant  
‹ Nominal Dimensions: 1.6 x 1.6 x 0.58 mm  
‹ Lead Finish: NiPdAu  
‹ Molding compound flammability rating: UL 94V-0  
‹ Marking: Marking Code + Date Code  
‹ Packaging: Tape and Reel  
Applications  
‹ Multi Media Card (MMC) Interfaces  
‹ SATA Interfaces  
‹ SD Card Interfaces  
‹ SIM Ports  
These devices are in a 6-pin, RoHS/WEEE compliant,  
SLP1616P6 package measuring 1.6 x 1.6 x 0.58mm.  
The leads are spaced at a pitch of 0.5mm and are  
finished with lead-free NiPdAu.  
‹ MDDI Ports  
‹ MPPI Ports  
Circuit Diagram  
Pin Configuration  
1.6  
1
3
1.6  
6
1
2
5
6
0.5  
0.58  
GND  
SLP1616P6 (Bottom View)  
Nominal Dimensions in mm  
www.semtech.com  
1
Revision 01/15/2008  

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