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RB751V-40WSRRG PDF预览

RB751V-40WSRRG

更新时间: 2024-09-23 09:37:51
品牌 Logo 应用领域
TSC 二极管
页数 文件大小 规格书
3页 150K
描述
200mW, Low VF SMD Schottky Barrier Diode

RB751V-40WSRRG 数据手册

 浏览型号RB751V-40WSRRG的Datasheet PDF文件第2页浏览型号RB751V-40WSRRG的Datasheet PDF文件第3页 
RB751V-40WS  
200mW, Low VF SMD Schottky Barrier Diode  
Small Signal Diode  
SOD-323F  
B
C
A
Features  
—Low power loss, high current capability, low VF, low IR  
—Surface device type mounting  
—Moisture sensitivity level 1  
D
—Pb free version and RoHS compliant  
E
F
—Green compound (Halogen free) with suffix "G" on  
packing code and prefix "G" on date code  
Unit (mm)  
Unit (inch)  
Dimensions  
Min  
1.15  
2.30  
0.25  
1.60  
0.80  
0.05  
Max  
Min  
Max  
Mechanical Data  
—Case : Flat lead SOD-323F small outline plastic package  
A
B
C
D
E
F
1.40 0.045 0.055  
2.80 0.091 0.110  
0.40 0.010 0.016  
1.80 0.063 0.071  
1.10 0.031 0.043  
0.15 0.002 0.006  
—Terminal: Matte tin plated, lead free., solderable  
per MIL-STD-202, Method 208 guaranteed  
—High temperature soldering guaranteed: 260°C/10s  
—Polarity : Indicated by cathode band  
—Weight :4.6 ± 0.5 mg  
—Marking Code : S8  
Pin Configuration  
Ordering Information  
Marking  
S8  
Package  
Part No.  
Packing  
Suggested PAD Layout  
SOD-323F RB751V-40WS RR  
3K / 7" Reel  
S8  
SOD-323F RB751V-40WS RRG 3K / 7" Reel  
Dimensions  
Value (in mm)  
0.710  
X
X1  
Y
2.900  
0.403  
Maximum Ratings and Electrical Characteristics  
Rating at 25°C ambient temperature unless otherwise specified.  
Maximum Ratings  
Type Number  
Symbol  
PD  
Value  
Units  
mW  
V
Power Dissipation  
200  
40  
Repetitive Peak Reverse Voltage  
Reverse Voltage (DC)  
VRRM  
VR  
30  
V
Average Forward Current  
IO  
30  
mA  
A
Non-Repetitive Peak Forward Surge Current (Note 1)  
Thermal Resistance (Junction to Ambient)  
Junction Temperature  
IFSM  
0.2  
RθJA  
TJ  
500  
125  
-40~125  
°C/W  
°C  
Storage Temperature Range  
TSTG  
°C  
Notes: 1. Test Condition : 8.3ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method)  
2. ESD sensitive product hankling required.  
3. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts  
may vary despending on application.  
Version : B10  

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