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R463I33305001K

更新时间： 2024-01-14 02:11:04
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
17页 1506K
描述
Film Capacitor, Polypropylene, 630V, 10% +Tol, 10% -Tol, 0.33uF, Through Hole Mount, 7151, RADIAL LEADED

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R463I33305001K 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 7151
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.25.00.70风险等级：1.64
其他特性：RATED AC VOLTAGE (V): 300电容：0.33 µF
电容器类型：FILM CAPACITOR介电材料：POLYPROPYLENE
高度：12 mmJESD-609代码：e3
长度：18 mm安装特点：THROUGH HOLE MOUNT
负容差：10%端子数量：2
最高工作温度：110 °C最低工作温度：-40 °C
封装形状：RECTANGULAR PACKAGE封装形式：Radial
包装方法：BULK正容差：10%
额定（AC）电压（URac）：300 V额定（直流）电压（URdc）：630 V
尺寸代码：7151表面贴装：NO
端子面层：Tin (Sn)端子节距：15 mm
端子形状：WIRE宽度：13 mm
Base Number Matches：1

R463I33305001K 数据手册

 浏览型号R463I33305001K的Datasheet PDF文件第6页浏览型号R463I33305001K的Datasheet PDF文件第7页浏览型号R463I33305001K的Datasheet PDF文件第8页浏览型号R463I33305001K的Datasheet PDF文件第10页浏览型号R463I33305001K的Datasheet PDF文件第11页浏览型号R463I33305001K的Datasheet PDF文件第12页 
Metallized Polypropylene Film EMI Suppression Capacitors  
R46 Series, Class X2, 310 VAC, 110ºC  
Soldering Process  
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder.  
Thisꢀhasꢀincreasedꢀtheꢀliquidusꢀtemperatureꢀfromꢀthatꢀofꢀ183ºCꢀforꢀSnPbꢀeutecticꢀalloyꢀtoꢀ217ꢀ–ꢀ221ºCꢀforꢀtheꢀnewꢀalloys.ꢀAsꢀaꢀ  
result,ꢀtheꢀheatꢀstressꢀtoꢀtheꢀcomponents,ꢀevenꢀinꢀwaveꢀsoldering,ꢀhasꢀincreasedꢀconsiderablyꢀdueꢀtoꢀhigherꢀpre-heatꢀandꢀwaveꢀ  
temperatures.ꢀPolypropyleneꢀcapacitorsꢀareꢀespeciallyꢀsensitiveꢀtoꢀheatꢀ(theꢀmeltingꢀpointꢀofꢀpolypropyleneꢀisꢀ160ꢀ–ꢀ170ºC).ꢀWaveꢀ  
solderingꢀcanꢀbeꢀdestructive,ꢀespeciallyꢀforꢀmechanicallyꢀsmallꢀpolypropyleneꢀcapacitorsꢀ(withꢀleadꢀspacingꢀofꢀ5ꢀmmꢀtoꢀ15ꢀmm),ꢀ  
andꢀgreatꢀcareꢀhasꢀtoꢀbeꢀtakenꢀduringꢀsoldering.ꢀTheꢀrecommendedꢀsolderꢀprofilesꢀfromꢀKEMETꢀshouldꢀbeꢀused.ꢀPleaseꢀconsultꢀ  
KEMETꢀwithꢀanyꢀquestions.ꢀInꢀgeneral,ꢀtheꢀwaveꢀsolderingꢀcurveꢀfromꢀIECꢀPublicationꢀ61760-1ꢀEditionꢀ2ꢀservesꢀasꢀaꢀsolidꢀguidelineꢀ  
for successful soldering. Please see Figure 1.  
Reflowꢀsolderingꢀisꢀnotꢀrecommendedꢀforꢀthrough-holeꢀfilmꢀcapacitors.ꢀExposingꢀcapacitorsꢀtoꢀaꢀsolderingꢀprofileꢀinꢀexcessꢀofꢀtheꢀ  
aboveꢀtheꢀrecommendedꢀlimitsꢀmayꢀresultꢀtoꢀdegradationꢀorꢀpermanentꢀdamageꢀtoꢀtheꢀcapacitors.ꢀ  
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert  
through-holeꢀpartsꢀafterꢀtheꢀcuringꢀofꢀsurfaceꢀmountꢀparts.ꢀConsultꢀKEMETꢀtoꢀdiscussꢀtheꢀactualꢀtemperatureꢀprofileꢀinꢀtheꢀoven,ꢀ  
if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended.  
Pleaseꢀallowꢀtimeꢀforꢀtheꢀcapacitorꢀsurfaceꢀtemperatureꢀtoꢀreturnꢀtoꢀaꢀnormalꢀtemperatureꢀbeforeꢀtheꢀsecondꢀsolderingꢀcycle.  
Manual Soldering Recommendations  
Wave Soldering Recommendations  
300  
Following is the recommendation for manual  
soldering with a soldering iron.  
2+3s max  
260°C  
250  
200  
150  
100  
50  
Firstwave  
Second wave  
Recommended Soldering Temperature  
ΔT <150°C  
Cooling  
400  
Preheating  
ca 2°C/s  
350  
300  
250  
200  
150  
100  
50  
ca 3.5°C/s typical  
ca 5°C/s  
115°C max  
Tpreheat  
100°C  
Typical  
0
0
40  
80  
120  
160  
200  
240  
Time (s)  
0
0
1
2
3
4
5
6
7
8
Soldering time (sec)  
The soldering iron tip temperature should  
beꢀsetꢀatꢀ350°Cꢀ(+10°Cꢀmaximum)ꢀwithꢀtheꢀ  
soldering duration not to exceed more than 3  
seconds.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.comF3095_R46_X2_310_110C • 9/27/2016  
9
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