QTS-XXX-XX-XXX-D-DP-XX
.006 0.15
REF
ASO ONLY (APPLICATION SPECIFIC ORDER)
REVISION Q
No OF POSITIONS
OPTION
-016, -032, -048,
**-064, **-080
(PER ROW)
DO NOT
SCALE FROM
THIS PRINT
-A: ALIGNMENT PINS (SEE FIG 2)
(USE QTS-25-01-D-XX-A)
-LC: LOCKING CLIPS (SEE FIG 1, NOTE 15)
(USE LC-08-TM-01)
(No OF POS/16) x .7875[20.003] REF
C
**SEE NOTE 14
DETAIL 'A'
SCALE 6 : 1
-K: POLYIMIDE FILM PAD OPTION
(SEE FIG 3, SHT. 2)
LEAD STYLE
7 EQ SPACES @ .075[1.91]
.7875 20.003 REF
-01: .1680[4.267]
-02: .2861[7.264]
-03: .4042[1.123]
-04: .6000[15.240]
-05: .7180[18.237]
-06: .8360[21.234]
(USE K-500-300)
-TR: TAPE & REEL OPTION
(48 POS MAX)
01
*
*
-DP: DIFFERENTIAL PAIRS
ROW SPECIFICATION
.155 3.94 REF
(SEE NOTE 16)
.235 5.97
REF
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD, MATTE TIN TAILS
(USE T-1SXX-XX-F & T-1G1-XX-F)(SEE NOTE 11)
-L: LIGHT SELECTIVE GOLD, MATTE TIN TAILS
(USE T-1SXX-XX-L & T-1G1-XX-L)
-H: HEAVY GOLD
(USE T-1SXX-XX-H & T-1G1-XX-G)
-D: DOUBLE
(SEE TABLE 3)
02
.644 16.36 REF
= SEE SHEET 3
* = NOT ENGINEERING APPROVED
.0325 0.826 REF
.008 0.20 REF
.075 1.91 REF
-STL: HEAVY SELECTIVE GOLD, TIN LEAD TAILS
(USE T-1SXX-XX-STL & T-1G1-XX-STL)
-FTL: FLASH SELECTIVE GOLD, TIN LEAD TAILS
(USE T-1SXX-XX-FTL & T-1G1-XX-FTL)
.025 0.64 REF
QTS-25-01-D-XX
C
"A"
"A"
.055 1.40
T-1S56-XX-XXX
.155±.003 3.94±0.08
.003[.08]
.001[.03]
"A"
"B" REF
Q
C
(SEE NOTES 9, 10 & 12)
C
'A'
C
SEE TABLE 2
.745 18.92 REF
LC-08-TM-01
.010 0.25 REF
(SEE NOTES 10 & 12)
.280 7.11 REF
({(No OF POS/16) x .7875[20.003]} - .060[1.52]) .003[.08]
T-1G1-XX-XXX
.037 0.94 REF
.0375 0.953 REF
.015 0.38 REF
2 MAX SWAY
FIG 1
NOTES:
(TYP)
SECTION "A"-"A"
REPRESENTS A CRITICAL DIMENSION.
C
1.
QTS-048-01-XXX-D-DP-LC SHOWN
2. NOTE WAS DELETED.
QTS-25-01-D-XX-A
3. NOTE WAS DELETED.
.0375 0.953
REF
4. MINIMUM TERMINAL RETENTION: 5 OZ.
5. MINIMUM GROUND PLANE RETENTION: 1 LB.
6. NOTE WAS DELETED.
7. PARTS TO BE MOLDED TO POSITION.
8. NOTE WAS DELETED.
9. MAXIMUM VARIANCE OF .002[.05].
{(No OF POS/16) x .7875[20.003]} - .060[1.52] REF
.035 0.89
REF
10. DIMENSION APPLIES TO TERMINALS AND GROUND PLANES INDEPENDENT OF
THE GROUND PLANE OR TERMINAL RESPECTIVELY.
FIG 2
11. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
.0375 0.953
REF
-A: ALIGNMENT PIN OPTION SHOWN
12. GROUND PLANE PRESS HEIGHT MUST BE .003[.08] LESS THAN THE MAX
HEIGHT OR .001[.03] GREATER THAN THE MINIMUM HEIGHT OF THE TERMINALS.
13. LEAD STYLES -03 THRU -06: TOP BODY (QTS) CANNOT HAVE -A OPTION.
14. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT
SAMTEC INTERCONNECT PROCESSING GROUP.
15. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED, THE –LC OPTION IS
NOT COMPATIBLE WITH AUTO PLACEMENT. SAMTEC RECOMMENDS MANUAL
PLACEMENT FOR ALL ASSEMBLIES WITH THE –LC OPTION."
16. MINIMUM ROW TO ROW IS .152, PIN CAN EXTEND PAST WALL .003 MAX.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
TOLERANCES ARE:
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
DECIMALS
ANGLES
2
.XX: .01[.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005[.13]
.XXXX: .0020[.051]
PHONE: 812-944-6733
FAX: 812-948-5047
code: 55322
CONSENT OF SAMTEC, INC.
e-Mail: info@SAMTEC.com
SHEET SCALE: 1.5:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
.635mm DIFFERENTIAL PAIRS HS TERMINAL ASSEMBLY
INSULATOR: LCP, COLOR: BLACK
TERMINAL & GROUND PLANE: PHOS BRONZE
DWG.
QNTOS. -XXX-XX-XXX-D-DP-XX
BY:
KEVIN B
09-14-2010 SHEET 1 OF 3
F:\DWG\MISC\MKTG\QTS-XXX-XX-XXX-D-DP-XX-MKT.SLDDRW
5秒后页面跳转
STM32H743技术深度剖析与应用案例探索
LM321中文资料解析：引脚功能介绍、技术特点、技术特性分析
74HC14芯片资料介绍：性能特性分析、引脚介绍
LM1875芯片手册：功放参数分析、引脚说明、电路设计要点
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
