F-211-1
QTH–090–01–C–D–A
®
QTH–030–01–L–D–A–RT1
(0,50mm) .0197"
QTH SERIES
QTH–060–07–F–D–A
HIGH SPEED GROUND PLANE HEADER
Integral metal plane for
power or ground
Standard
Stack
Heights
from 5mm
to 25mm
Board Mates:
SPECIFICATIONS
QSH
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Cable Mates:
HFHM2, HQCD,
HQDP
(See Application
Specific note)
• Retention pin
option
®
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
TM
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSH
5mm Stack Height
Type
–D
Rated @ 3dB Insertion Loss
9 GHz / 18 Gbps
Voltage Rating:
Polarized
Single-Ended Signaling
Differential Pair Signaling
125 VAC (5mm Stack Height)
Max Cycles:
–D
8 GHz / 16 Gbps
100
ALSO AVAILABLE
Differential Pair Signaling –DP
9.5 GHz / 19 Gbps
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Performance data for other stack heights and complete
test data available at www.samtec.com?QTH or contact
sig@samtec.com
Board Spacing Standoffs.
See SO Series.
Processing:
LEAD
PINS PER ROW
NO. OF PAIRS
PLATING
OTHER
Lead–Free Solderable:
Yes
TYPE
QTH
A
STYLE
OPTION
OPTION
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
Specify
LEAD
STYLE
from
–K
= (7,00mm)
.275" DIA
–F
–D
–030, –060, –090, –120
= Gold Flash on
Signal Pins and
Ground Plane,
MatteTin on tails
= Single-Ended
(60 total pins per bank = –D)
Polyimide film
Pick &
Place Pad
(N/A with -05 &
-07 lead style)
chart
–D–DP
= Differential Pair
(–01 only)
–020, –040, –060, –080
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
(20 pairs per bank = –D–DP)
–L
–D = (No. of Pins per Row/30) x (20,00) .7875
–DP = (No. of Pairs per Row/20) x (20,00) .7875
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
MatteTin on tails
–TR
= Tape & Reel
(–090 positions
maximum)
(20,00) .7875
01
(7,11)
.280
–C*
component height
restrictions. Please consult
machinery specifications.)
–RT1
= Retention
Option
(–01 lead style
only & –090
positions
= Electro-Polished
Selective
02
(0,50)
.0197
(0,20)
.008
50µ" (1,27µm) min Au
over 150µ" (3,81µm)
Ni on Signal Pins
in contact area,
10µ" (0,25µm) min Au
over 50µ" (1,27µm)
Ni on Ground Plane
in contact area,
QTH
LEAD
STYLE
HEIGHT
WITH
QSH*
• 30µ" (0,76µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
A
A
(4,27) (5,00)
maximum)
–01
–02
–03
–04
–05
–07
.168 .197
A
–01 & –02
(7,26) (8,00)
.286 .315
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP),
–080, –090
& –120 or
–RT1 option)
(10,27) (11,00)
.404 .433
–03 thru –07
MatteTin over 50µ"
(1,27µm) min Ni
on all solder tails
(15,25) (16,00)
.600 .630
(3,30) .130
(0,76)
.030
(1,57)
.062
(18,26) (19,00)
.718 .748
(24,24) (25,00)
.954 .984
*Note: –C Plating passes
10 year MFG testing
(0,64)
.025
(1,57)
.062
DIA
(0,89)
.035
DIA
*Processing conditions
will affect mated height.
–L
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–RT1
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