F213 (Rev 20AUG13)
QSE–028–01–F–D–DP–A
®
QSE–060–01–F–D–A
QSE–020–01–L–D–A
(0,80 mm) .0315"
QSE SERIES
HIGH SPEED GROUND PLANE SOCKET
Integral metal plane
Blade &
Beam
for power or ground
Board Mates:
QTE
SPECIFICATIONS
Design
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
TM
Plating: Au or Sn over
50µ" (1,27 µm) Ni
EXTENDED LIFE PRODUCT
Current Rating:
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTE
Contacts:
1.3A per contact @ 95°C
Ground Plane:
10.1A per ground plane @ 95°C
Operating Temp Range:
-55°C to +125°C
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
QTE/QSE
Type
5 mm Stack Height
Voltage Rating:
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
–D
–D
9 GHz / 18 Gbps
8 GHz / 16 Gbps
9 GHz / 18 Gbps
14 GHz / 28 Gbps
225 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
Processing:
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact sig@samtec.com
For applications requiring more
than two connectors per board
contact ipg@samtec.com
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
TYPE
QSE
A
01
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
–F
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–D
= Single-
Ended
–GP
–020, –040, –060
= Guide Post
(–020 only)
(40 total pins per bank = –D)
FILE NO: 090871_0_000
–014, –028, –042
ALSO AVAILABLE
–D–DP
= Differential
Pair
–K
(14 pairs per bank = –D–DP)
–L
(MOQ Required)
= (8,25 mm) .325"
DIA Polyimide
Film Pick &
= 10µ" (0,25 µm) Gold
on Signal Pins
–D–DP = (No. of Positions per Row/14) x
(20,00) .7875 + (1,27) .050
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
(–01 only)
and Ground Plane,
Matte Tin on tails
Place Pad
–D = (No. of Positions per Row/20) x
(20,00) .7875 + (1,27) .050
–TR
–C*
= Tape & Reel
Packaging
(20,00) .7875
= Electro-Polished
Selective
02
QTE
MATED
(7,49)
.295
50µ" (1,27 µm) min
(7,24)
.285
LEAD HEIGHT
–L
Au over 150µ"
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min
Au over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
MatteTin over 50µ"
(1,27 µm) min Ni on
all solder tails
STYLE WITH QSE*
= Latching Option
(N/A on –042
& –060 positions)
(5,00) .197
01
–01
(0,80)
.0315
(0,15)
.006
(8,00) .315
(11,00) .433
(16,00) .630
(19,00) .748
(25,00) .984
–02
–03
–04
–05
–07
(3,25)
.128
• Guide Posts and Friction
Lock options
.
(3,05)
.120
*Processing conditions
will affect mated
height.
• Retention Option
Contact Samtec.
(0,76)
.030
.
OTHER
(0,89)
.035
DIA
*Note: –C Plating passes
(0,64)
.025
SOLUTIONS
10 year MFG testing
Board Spacing Standoffs.
See SO Series.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–L
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