Teccor® brandThyristors
10 Amp Standard & Alternistor (High Communitation) Triacs
Soldering Parameters
Reflow Condition
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tP
TP
-Temperature Min (Ts(min)
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
-Time (min to max) (ts)
)
200°C
tL
ꢄꢅꢀoꢀꢆꢇꢅꢀTFDT
Ramp-down
Preheat
Average ramp up rate (LiquidusTemp)
(TL) to peak
5°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
5°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
-Temperature (tL)
ꢄꢅꢀoꢀꢆꢈꢅꢀTFDPOET
260+0/-5 °C
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
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Ramp-down Rate
5°C/second max
8 minutes Max.
280°C
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
Test
AC Blocking
Specifications and Conditions
Terminal Finish
Body Material
100% MatteTin-plated
MIL-STD-750, M-1040, Cond A Applied
Peak AC voltage @ 125°C for 1008 hours
UL recognized epoxy meeting flammabilty
classification 94V-0.
MIL-STD-750, M-1051, 100 cycles; -40°C
to +150°C, 15-min dwell-time
Temperature Cycling
Temperature/
Humidity
EIA/JEDEC, JESD22-A101 1008 hours;
320V - DC: 85°C; 85% rel humidity
Terminal Material
Copper Alloy
MIL-STD-750, M-1031,
1008 hours; 150°C
HighTemp Storage
Low-Temp Storage
1008 hours; -40°C
Design Considerations
MIL-STD-750, M-1056 10 cycles; 0°C
to 100°C; 5-min dwell time at each
temperature; 10 sec (max) transfer time
between temperature
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of theThyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Thermal Shock
EIA/JEDEC, JESD22-A102 168 hours
(121°C at 2 ATMs) and 100% R/H
Autoclave
Resistance to
Solder Heat
MIL-STD-750 Method 2031
Solderability
Lead Bend
ANSI/J-STD-002, category 3Test A
MIL-STD-750, M-2036 Cond E
Qxx10xx & Qxx10xHx Series
©2013 Littelfuse, Inc
Specifications are subject to change without notice.
102
Revised: 09/23/13