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PT6464

更新时间: 2024-02-14 16:08:30
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德州仪器 - TI 稳压器开关
页数 文件大小 规格书
10页 191K
描述
14-A 5-V Input Adjustable Integrated Switching Regulator

PT6464 技术参数

是否无铅: 含铅生命周期:Obsolete
零件包装代码:MODULE包装说明:, SIP12
针数:12Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.83模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制模式:VOLTAGE-MODE最大输入电压:5.5 V
最小输入电压:4.5 V标称输入电压:5 V
JESD-30 代码:R-XSMA-T12功能数量:1
端子数量:12最高工作温度:85 °C
最低工作温度:-40 °C最大输出电流:14 A
封装主体材料:UNSPECIFIED封装等效代码:SIP12
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified子类别:Switching Regulator or Controllers
表面贴装:NO切换器配置:BUCK
技术:HYBRID温度等级:INDUSTRIAL
端子形式:THROUGH-HOLE端子位置:SINGLE
Base Number Matches:1

PT6464 数据手册

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PT6460 Series  
14-A 5-V Input Adjustable  
Integrated Switching Regulator  
SLTS178B - JANUARY 2003 - REVISED JUNE 2003  
Specifications (Unless otherwise stated, Ta =25 °C, Vin =5 V, Cin =470 µF, Cout =0 µF, and Io =Iomax)  
PT6460 SERIES  
Characteristics  
Symbols  
Conditions  
Min  
Typ  
Max  
Units  
Output Current  
Io  
Vin  
Vin =5 V  
Over Io range  
0
0.5  
10  
12  
14  
5.5  
2
A
V
%Vo  
%Vo  
mV  
mV  
Input Voltage Range  
Set-Point Voltage Tolerance  
Temperature Variation  
Line Regulation  
Load Regulation  
Total Output Variation  
4.5  
Vo tol  
Regtemp  
Regline  
Regload  
Regtot  
–40 °C <Ta < +85 °C  
Over Vin range  
Over Io range  
Includes set-point, line, load,  
3
%Vo  
–40 °C Ta +85 °C  
Efficiency  
η
Io =10 A  
PT6461 (3.3 V)  
PT6462 (2.5 V)  
PT6463 (2.0 V)  
PT6464 (1.8 V)  
PT6465 (1.5 V)  
PT6466 (1.2 V)  
PT6467 (1.0 V)  
94  
93  
91  
90  
88  
86  
84  
%
Vo Ripple (pk-pk)  
Vr  
20MHz  
bandwidth—  
25  
mVpp  
Transient Response  
1 A/µs load step, 50 to 100 % Iomax,  
Cout =330 µF  
ttr  
Recovery Time  
Vo over/undershoot  
50  
µSec  
mV  
Vtr  
100  
Over-Current Threshold  
Output Voltage Adjust  
Switching Frequency  
ITRIP  
Vo adj  
ƒs  
Reset, followed by auto-recovery  
27.5  
15  
300  
A
%
kHz  
(1)  
Over Vin and Io ranges  
Inhibit Control (pin1)  
Input High Voltage  
Input Low Voltage  
Referenced to GND (pins 5–8)  
(2)  
VIH  
VIL  
IIL  
Vin –0.5  
–0.2  
–10  
5
330  
Open  
0.8  
3,300  
85  
215  
125  
V
Input Low Current  
Pin 1 to GND  
Pin 1 to GND  
µA  
mA  
µF  
µF  
°C  
°C  
°C  
Inhibit Input Current  
External Input Capacitance  
External Output Capacitance  
Operating Temperature Range  
Solder Reflow Temperature  
Storage Temperature  
Iin inhibit  
Cin  
Cout  
(3)  
470  
(4) (5)  
0
(5)  
(6)  
T
Over Vin range  
Surface temperature of module pins or case  
–40  
a
(7)  
Treflow  
T
s
–40  
Reliability  
MTBF  
Per Bellcore TR-332  
50 % stress, Ta =40 °C, ground benign  
6
8.0  
10 Hrs  
Mechanical Shock  
Mil-STD-883D, Method 2002.3  
Half Sine, mounted to a fixture  
500  
G
(8)  
(8)  
Mechanical Vibration  
Mil-STD-883D, Method 2007.2,  
20-2000 Hz, PCB mounted  
Suffix N  
Suffixes A, C  
20  
20  
G
Weight  
Flammability  
10  
grams  
Materials meet UL 94V-0  
Notes: (1) This is a typical value. For the adjustment limits of a specific model consult the related application note on output voltage adjustment.  
(2) The Inhibit control (pin 1) has an internal pull-up, and if left open-circuit the module will operate when input power is applied. A small low-leakage  
(<100 nA) MOSFET is recommended to control this input. See application notes for more information.  
(3) A 470 µF electrolytic input capacitor is required for proper operation. The capacitor must be rated for a minimumm of 0.7 Arms of ripple current.  
(4) An external output capacitor is not required for basic operation. Adding 330 µF of distributed capacitance at the load will improve the transient response.  
(5) For operation below 0 °C, COUT should have stable characteristics. Use either low-ESR tantalum or Oscon® type capacitors.  
(6) See SOA curves or consult factory for the appropriate derating.  
(7) During solder reflow of SMD package version do not elevate the module case, pins, or internal component temperature above a peak of 215 °C. For  
further guidance refer to the application note, “Reflow Soldering Requirements for Plug-in Power Surface Mount Products,” (SLTA051).  
(8) The case pins on the through-hole package types (suffixes N & A) must be soldered. For more information see the applicable package outline drawing.  
For technical support and more information, see inside back cover or visit www.ti.com  

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