Product specification
7
9
SERIES
0402/0603/0805/1206/2010/2512
PT
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
MIL-STD-202 Method 304
At +25/+125 °C
Refer to table 2
Coefficient of
Resistance (T.C.R.)
Formula:
R2–R1
T.C.R= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=+125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Life/
Endurance
MIL-STD-202 Method 108A
IEC 60115-1 4.25.1
1,000 hours at 70±2 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (1.0%+0.0005 Ω)
± (1.0%+0.0005 Ω)
High Temperature
Exposure
MIL-STD-202 Method 108A
IEC 60068-2-2
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 155± 3 °C
Moisture Resistance
MIL-STD-202 Method 106
Each temperature / humidity cycle is defined at 8 ± (0.5%+0.0005 Ω)
hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202 Method 107
-55/+125 °C
± (1.0%+0.0005 Ω)
Number of cycles required is 300. Maximum
Devices mounted:
transfer time is 20 seconds. Dwell time is 15
minutes. Air – Air
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Dec. 30, 2015 V.1