PPJQ1900
Electrical Characteristics (TA=25oC unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNITS
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
BVDSS
VGS(th)
VGS=0V, ID=250uA
VDS=VGS, ID=250uA
VGS=4.5V, ID=600mA
VGS=2.5V, ID=200mA
VGS=1.8V, ID=100mA
VGS=1.5V, ID=50mA
VGS=1.2V, ID=20mA
VDS=16V, VGS=0V
VGS=+8V, VDS=0V
20
-
-
V
V
0.3
0.65
300
350
400
500
1000
-
0.9
-
-
-
-
-
-
-
400
650
800
1200
3000
1
Drain-Source On-State Resistance
RDS(on)
mΩ
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Dynamic (Note 6)
IDSS
IGSS
uA
uA
+0.5
+10
Total Gate Charge
Qg
Qgs
Qgd
Ciss
Coss
Crss
td(on)
tr
-
-
-
-
-
-
-
-
-
-
1.4
0.22
0.21
67
-
-
-
-
-
-
-
-
-
-
VDS=10V, ID=300mA,
VGS=4.5V (Note 2)
Gate-Source Charge
Gate-Drain Charge
nC
pF
Input Capacitance
VDS=10V, VGS=0V,
f=1.0MHZ
Output Capacitance
19
Reverse Transfer Capacitance
Turn-On Delay Time
6
2.8
20
VDD=10V, ID=150mA,
VGS=4.0V,
RG=10Ω (Note 1,2)
Turn-On Rise Time
ns
Turn-Off Delay Time
td(off)
tf
23
Turn-Off Fall Time
23
Drain-Source Diode
Maximum Continuous Drain-Source
Diode Forward Current
IS
---
-
-
-
300
1.3
mA
V
Diode Forward Voltage
VSD
IS=300mA, VGS=0V
0.87
NOTES :
1. Pulse width<300us, Duty cycle<2%
2. Essentially independent of operating temperature typical characteristics.
3. Tsp is the temperature at the soldering point of the source lead.
4. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is
defined as the solder mounting surface of the drain pins mounted on a 1inch FR-4 with 2oz. square pad of copper.
5. The maximum current rating is package limited
6. Guaranteed by design, not subject to production testing.
August 28,2015-REV.00
Page 2