PIC18F2525/2620/4525/4620
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 23
3.0 Power-Managed Modes ............................................................................................................................................................. 33
4.0 Reset.......................................................................................................................................................................................... 41
5.0 Memory Organization................................................................................................................................................................. 53
6.0 Data EEPROM Memory ............................................................................................................................................................. 73
7.0 Flash Program Memory.............................................................................................................................................................. 79
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 89
9.0 I/O Ports ..................................................................................................................................................................................... 91
10.0 Interrupts .................................................................................................................................................................................. 109
11.0 Timer0 Module ......................................................................................................................................................................... 123
12.0 Timer1 Module ......................................................................................................................................................................... 127
13.0 Timer2 Module ......................................................................................................................................................................... 133
14.0 Timer3 Module ......................................................................................................................................................................... 135
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 139
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 201
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223
20.0 Comparator Module.................................................................................................................................................................. 233
21.0 Comparator Voltage Reference Module................................................................................................................................... 239
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243
23.0 Special Features of the CPU.................................................................................................................................................... 249
24.0 Instruction Set Summary.......................................................................................................................................................... 267
25.0 Development Support............................................................................................................................................................... 317
26.0 Electrical Characteristics .......................................................................................................................................................... 321
27.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 361
28.0 Packaging Information.............................................................................................................................................................. 383
Appendix A: Revision History............................................................................................................................................................. 393
Appendix B: Device Differences......................................................................................................................................................... 394
Appendix C: Conversion Considerations ........................................................................................................................................... 395
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 395
Appendix E: Migration from Mid-Range TO Enhanced Devices ........................................................................................................ 396
Appendix F: Migration from High-End to Enhanced Devices............................................................................................................. 396
Index .................................................................................................................................................................................................. 397
The Microchip Web Site..................................................................................................................................................................... 407
Customer Change Notification Service .............................................................................................................................................. 407
Customer Support.............................................................................................................................................................................. 407
Reader Response .............................................................................................................................................................................. 408
PIC18F2525/2620/4525/4620 Product Identification System ............................................................................................................ 409
DS39626E-page 4
© 2008 Microchip Technology Inc.
5秒后页面跳转
高性能TDA7293音频功率放大器技术特性与应用分析
STM32H743技术深度剖析与应用案例探索
LM321中文资料解析：引脚功能介绍、技术特点、技术特性分析
74HC14芯片资料介绍：性能特性分析、引脚介绍
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
