是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.600 INCH, WINDOWED, CERAMIC, DIP-40 | 针数: | 40 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.47 | 具有ADC: | NO |
地址总线宽度: | 位大小: | 8 | |
最大时钟频率: | 10 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | R-CDIP-T40 | JESD-609代码: | e3 |
长度: | 52.07 mm | I/O 线路数量: | 33 |
端子数量: | 40 | 片上程序ROM宽度: | 14 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | RAM(字节): | 176 |
ROM(单词): | 4096 | ROM可编程性: | UVPROM |
速度: | 10 MHz | 最大压摆率: | 30 mA |
最大供电电压: | 6 V | 最小供电电压: | 4 V |
标称供电电压: | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 15.24 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
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PIC16C662-10I/L | MICROCHIP |
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PIC16C662-20/JW | MICROCHIP |
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PIC16C662-20/L | MICROCHIP |
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PIC16C662-20/P | MICROCHIP |
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PIC16C662-20/SO | MICROCHIP |
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PIC16C662-20/SP | MICROCHIP |
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8-Bit EPROM Microcontrollers with Analog Comparators |