生命周期: | Contact Manufacturer | 零件包装代码: | DIP |
包装说明: | DIP, DIP28,.3 | 针数: | 28 |
Reach Compliance Code: | compliant | 风险等级: | 5.32 |
具有ADC: | NO | 地址总线宽度: | |
位大小: | 8 | CPU系列: | PIC |
最大时钟频率: | 20 MHz | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-XDIP-T28 | |
长度: | 35.59 mm | I/O 线路数量: | 22 |
端子数量: | 28 | 最高工作温度: | 70 °C |
最低工作温度: | PWM 通道: | YES | |
封装主体材料: | CERAMIC | 封装代码: | DIP |
封装等效代码: | DIP28,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 电源: | 5 V |
认证状态: | Not Qualified | RAM(字节): | 368 |
ROM(单词): | 8192 | ROM可编程性: | UVPROM |
速度: | 5 MHz | 子类别: | Microcontrollers |
最大压摆率: | 20 mA | 最大供电电压: | 6 V |
最小供电电压: | 2.5 V | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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