System Acceleration Throughput per a single controller:
INTEL® C628 CHIPSET/
INTEL® C627 CHIPSET
INTEL® C626 CHIPSET
40Gbps
INTEL® C625 CHIPSET
20Gbps
SSL/IPSec
100Gbps
Compression Deflate
Decompression Deflate
RSA Decrypt 1k-bit
100Gbps
40Gbps
20Gbps
100Gbps
100Gbps
100Gbps
550K Ops/sec
100 Ops/Sec
440K Ops/sec
51K Ops/sec
550K Ops/sec
40 Ops/Sec
550K Ops/sec
20 Ops/Sec
RSA Decrypt 2k-bit
TLS Handshakes ECDH_RSA2K
TLS Handshakes EDHE+ECDSA
SSL/IPSec + Compression +
PKE
Total 120 Gbps +
100K Ops/sec
Technical Specifications
General Technical Specifications:
Interface Standard:
PCI-Express Base Specification Revision 3.0 (8 GTs)
Board Size:
Low profile short add-in card: 167.64 mm X 64.389mm (6.600”X 2.535”)
PCI Express Card Type:
PCI Express Voltage
PCI Connector:
X16 Lane
+12V +- 8% and external 3×2 connector
+3.3V AUX ± 9%
Gold Finger: X16
Intel® C628 Chipset
Intel® C627 Chipset
Intel® C626 Chipset
Intel® C625 Chipset
Controllers:
Holder:
Metal Bracket: Full Height and Low Height
Operating Humidity:
0%–90%, non-condensing
0°C – 45°C (32°F – 113F)
Operating Temperature:
Cooling
Air flow requirement for this adapter is 200 LFM
Heatsink With Integrated Fan.
(Stretch-Goal of Fanless Operation, which will require modeling)
Storage:
-40°C–65°C (-40°F–149°F)
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Silicom Ltd. Connectivity Solutions