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PE316IS2LBLL PDF预览

PE316IS2LBLL

更新时间: 2022-06-24 15:42:27
品牌 Logo 应用领域
矽晶电信 - SILICOM PC
页数 文件大小 规格书
3页 424K
描述
Dual Crypto / Compression LBG PCIe 3.0 Server Adapter

PE316IS2LBLL 数据手册

 浏览型号PE316IS2LBLL的Datasheet PDF文件第1页浏览型号PE316IS2LBLL的Datasheet PDF文件第3页 
System Acceleration Throughput per a single controller:  
INTEL® C628 CHIPSET/  
INTEL® C627 CHIPSET  
INTEL® C626 CHIPSET  
40Gbps  
INTEL® C625 CHIPSET  
20Gbps  
SSL/IPSec  
100Gbps  
Compression Deflate  
Decompression Deflate  
RSA Decrypt 1k-bit  
100Gbps  
40Gbps  
20Gbps  
100Gbps  
100Gbps  
100Gbps  
550K Ops/sec  
100 Ops/Sec  
440K Ops/sec  
51K Ops/sec  
550K Ops/sec  
40 Ops/Sec  
550K Ops/sec  
20 Ops/Sec  
RSA Decrypt 2k-bit  
TLS Handshakes ECDH_RSA2K  
TLS Handshakes EDHE+ECDSA  
SSL/IPSec + Compression +  
PKE  
Total 120 Gbps +  
100K Ops/sec  
Technical Specifications  
General Technical Specifications:  
Interface Standard:  
PCI-Express Base Specification Revision 3.0 (8 GTs)  
Board Size:  
Low profile short add-in card: 167.64 mm X 64.389mm (6.600”X 2.535”)  
PCI Express Card Type:  
PCI Express Voltage  
PCI Connector:  
X16 Lane  
+12V +- 8% and external 3×2 connector  
+3.3V AUX ± 9%  
Gold Finger: X16  
Intel® C628 Chipset  
Intel® C627 Chipset  
Intel® C626 Chipset  
Intel® C625 Chipset  
Controllers:  
Holder:  
Metal Bracket: Full Height and Low Height  
Operating Humidity:  
0%90%, non-condensing  
0°C 45°C (32°F 113F)  
Operating Temperature:  
Cooling  
Air flow requirement for this adapter is 200 LFM  
Heatsink With Integrated Fan.  
(Stretch-Goal of Fanless Operation, which will require modeling)  
Storage:  
-40°C65°C (-40°F149°F)  
2Page  
Silicom Ltd. Connectivity Solutions  

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