Datasheet > PCA9536DP,118

PCA9536DP,118

更新时间： 2024-02-16 03:51:00

品牌	Logo	应用领域
恩智浦 - NXP		PC 光电二极管外围集成电路
页数	文件大小	规格书
24页	216K
描述
PCA9536 - 4-bit I2C-bus and SMBus I/O port TSSOP 8-Pin

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PCA9536DP,118 技术参数

是否Rohs认证：	符合	生命周期：	Active
零件包装代码：	TSSOP	包装说明：	TSSOP, TSSOP8,.19
针数：	8	Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01	风险等级：	0.96
JESD-30 代码：	S-PDSO-G8	JESD-609代码：	e4
长度：	3 mm	湿度敏感等级：	1
位数：	4	I/O 线路数量：	4
端口数量：	1	端子数量：	8
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSSOP
封装等效代码：	TSSOP8,.19	封装形状：	SQUARE
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	峰值回流温度（摄氏度）：	260
电源：	2.5/5 V	认证状态：	Not Qualified
座面最大高度：	1.1 mm	子类别：	Parallel IO Port
最大供电电压：	5.5 V	最小供电电压：	2.3 V
标称供电电压：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)	端子形式：	GULL WING
端子节距：	0.65 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	30	宽度：	3 mm
uPs/uCs/外围集成电路类型：	PARALLEL IO PORT, GENERAL PURPOSE	Base Number Matches：	1

PCA9536DP,118 数据手册

PCA9536

NXP Semiconductors

4-bit I²C-bus and SMBus I/O port

13. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate precautions are taken as

described in JESD625-A or equivalent standards.

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

PCA9536

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 6 — 7 November 2017

18 of 24

1...15 16 171819 20 21...24

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与PCA9536DP,118相关器件

型号	品牌	描述	获取价格	数据表
PCA9536DP/DG,118	NXP	PCA9536 - 4-bit I2C-bus and SMBus I/O port TSSOP 8-Pin	获取价格
PCA9536DR	TI	REMOTE 4-BIT I2C AND SMBus I/O EXPANDER WITH CONFIGURATION REGISTERS	获取价格
PCA9536DRG4	TI	REMOTE 4-BIT I2C AND SMBus I/O EXPANDER WITH CONFIGURATION REGISTERS	获取价格
PCA9536DT	TI	REMOTE 4-BIT I2C AND SMBus I/O EXPANDER WITH CONFIGURATION REGISTERS	获取价格
PCA9536TK	NXP	4-bit I2C-bus and SMBus I/O port	获取价格
PCA9536YZPR	TI	REMOTE 4-BIT I2C AND SMBus I/O EXPANDER WITH CONFIGURATION REGISTERS	获取价格

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