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PCA8576F

更新时间: 2022-10-12 15:08:01
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
54页 428K
描述
Automotive 40 × 4 LCD driver

PCA8576F 数据手册

 浏览型号PCA8576F的Datasheet PDF文件第48页浏览型号PCA8576F的Datasheet PDF文件第49页浏览型号PCA8576F的Datasheet PDF文件第50页浏览型号PCA8576F的Datasheet PDF文件第52页浏览型号PCA8576F的Datasheet PDF文件第53页浏览型号PCA8576F的Datasheet PDF文件第54页 
PCA8576F  
NXP Semiconductors  
Automotive 40 × 4 LCD driver  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
NXP Semiconductors has no control of third party procedures in the sawing,  
handling, packing or assembly of the die. Accordingly, NXP Semiconductors  
assumes no liability for device functionality or performance of the die or  
systems after third party sawing, handling, packing or assembly of the die. It  
is the responsibility of the customer to test and qualify their application in  
which the die is used.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
All die sales are conditioned upon and subject to the customer entering into a  
written die sale agreement with NXP Semiconductors through its legal  
department.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
Bare die — All die are tested on compliance with their related technical  
specifications as stated in this data sheet up to the point of wafer sawing and  
are handled in accordance with the NXP Semiconductors storage and  
transportation conditions. If there are data sheet limits not guaranteed, these  
will be separately indicated in the data sheet. There are no post-packing tests  
performed on individual die or wafers.  
22.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
I2C-bus — logo is a trademark of NXP Semiconductors N.V.  
23. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
PCA8576F  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 3 — 3 December 2014  
51 of 54  

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