PAC.. Series
Vishay Draloric
www.vishay.com
BENDING FORMS
A
L
a
Ø D
I
b
WSZ
H
F
E
Solder pad dimensions
Ø d
TYPE
Ø d
0.8
Ø Dmax.
A
L
F
H
E
a
b
l
(1)
PAC02 WSZ
17 0.5
11 - 12
4.8 0.5 3.6 0.5 5.0 0.5
2.5
5.5
14.5
Δh1
P2
P
Ø D
L
H1
1 max.
W2
d
RADIAL TAPED = RT
H
H0
t
L1
F
W1
P1
W0
W
P0
D0
Direction of Unreeling
TYPE PAC01
Lead Ø
Ø d
Ø D
L
0.8
(1)
Diameter
(1)
Length
Pitch of components
Pitch of spocket holes (2)
P
12.7 1.0
12.7 0.3
3.85 0.7
6.35 1.0
5.0 + 0.6, - 0.1
2 max.
P0
P1
P2
F
Distance between hole center and resistor center
Distance between hole center and lead center
Lead spacing
Angle of insertion
h1
W
Width of carrier tape
18.0 0.5
12.0 0.5
9.0 0.5
Width of adhesive tape
Position of holes
W0
W1
W2
H
Position of adhesive tape
0.5 max.
Body to hole center
19.5 1.0
16.0 0.5
4.0 0.2
Lead crimp to hole center (3)
Hole Ø
Thickness of tape (4)
H0
D0
t
0.9 max.
Height for cutting
L1
H1
11 max.
Height for insertion
32 max.
Notes
(1)
(2)
(3)
(4)
See table DIMENSIONS
Test over 10 holes - 9 intervals P0 12.7 x 9 = 114.3 0.5
Parallelism, < 0.5 mm
Thickness of carrier tape: 0.55 mm 0.1
Revision: 14-Mar-17
Document Number: 28731
5
For technical questions, contact: ww1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000