P6SMB Series
Vishay General Semiconductor
THERMAL CHARACTERISTICS (T = 25 °C unless otherwise noted)
A
PARAMETER
Thermal resistance junction to ambient air (1)
SYMBOL
VALUE
100
UNIT
°C/W
°C/W
RθJA
Thermal resistance junction to leads
RθJL
20
Note:
(1) Mounted on minimum recommended pad layout
ORDERING INFORMATION
PREFERRED P/N
P6SMB6.8A-E3/52
P6SMB6.8A-E3/5B
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
0.096
52
5B
750
7" Diameter Plastic Tape & Reel
13" Diameter Plastic Tape & Reel
0.096
3200
RATINGS AND CHARACTERISTICS CURVES
(T = 25 °C unless otherwise noted)
A
150
100
100
10
1
Tj = 25 °C
Pulse Width (td)
is defined as the point
where the peak current
decays to 50 % of IPPM
tr = 10 µsec
Peak Value
I
PPM
I
2
PP
Half Value -
IPPM
50
0
10/1000 µsec Waveform
as defined by R.E.A.
0.2 x 0.2" (0.5 x 0.5 mm)
Copper Pad Areas
td
0.1
0.1 µs
1.0 µs
10 µs
100 µs
1.0 ms
10 ms
1.0
3.0
4.0
0
2.0
t - Time (ms)
td - Pulse Width (s)
Figure 1. Peak Pulse Power Rating Curve
Figure 3. Pulse Waveform
100
75
6000
1000
Measured at
Zero Bias
50
V
R, Measured at
100
10
Stand-off Voltage VWM
25
T
j
= 25 °C
Uni-Directional
Bi-Directional
f = 1.0 MHz
V
sig = 50 mVp-p
0
1
10
100
200
0
25
50
75
100 125
150 175
200
TJ - Initial Temperature (°C)
V
WM - Reverse Stand-off Voltage (V)
Figure 2. Pulse Power or Current versus Initial Junction
Temperature
Figure 4. Typical Junction Capacitance
Document Number 88370
08-Sep-06
www.vishay.com
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