P3C1256L70P6I PDF预览

P3C1256L70P6I

更新时间: 2025-07-16 08:30:03
品牌 Logo 应用领域
PYRAMID 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
11页 729K
描述
Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

P3C1256L70P6I 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:DIP包装说明:DIP,
针数:28Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.74最长访问时间:70 ns
JESD-30 代码:R-PDIP-T28JESD-609代码:e0
长度:35.687 mm内存密度:262144 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:28
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:32KX8
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:5.08 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mm

P3C1256L70P6I 数据手册

 浏览型号P3C1256L70P6I的Datasheet PDF文件第2页浏览型号P3C1256L70P6I的Datasheet PDF文件第3页浏览型号P3C1256L70P6I的Datasheet PDF文件第4页浏览型号P3C1256L70P6I的Datasheet PDF文件第5页浏览型号P3C1256L70P6I的Datasheet PDF文件第6页浏览型号P3C1256L70P6I的Datasheet PDF文件第7页 
P3C1256L  
LOW POWER 32K x 8  
STATIC CMOS RAM  
FEATURES  
VCC Current (Commercial/Industrial)  
— Operating: 70mA/85mA  
— CMOS Standby: 100µA/100µA  
Three-State Outputs  
Fully TTL Compatible Inputs and Outputs  
Advanced CMOS Technology  
Automatic Power Down  
Packages  
Access Times  
—55/70/85  
— 28-Pin 600 mil DIP  
— 28-Pin 330 mil SOP  
— 28-Pin TSOP  
Wide Range Power Supply: 2.7V to 3.6V  
Easy Memory Expansion Using CE and OE Inputs  
Common Data I/O  
DESCRIPTIOꢀ  
The P3C1256L is a 262,144-bit low power CMOS  
static RAM organized as 32Kx8. The CMOS memory  
requires no clocks or refreshing, and has equal access and  
cycle times. Inputs are fully TTL-compatible. The RAM  
operates with a wide range power supply (2.7V to 3.6V).  
with matching access and cycle times. Memory locations  
are specified on address pinsA0 toA14. Reading is accom-  
plished by device selection (CE and output enabling (OE)  
while write enable (WE) remains HIGH. By presenting the  
address under these conditions, the data in the addressed  
memory location is presented on the data input/output pins.  
The input/output pins stay in the HIGH Z state when either  
CE or OE is HIGH or WE is LOW.  
Access times of 55 ns and 70 ns are available. CMOS is  
utilized to reduce power consumption to a low level.  
The P3C1256L device provides asynchronous operation  
FUꢀCTIOꢀAL BLOCꢁ DIAꢂRAM  
PIꢀ COꢀFIꢂURATIOꢀS  
DIP (P6), SOP (S11-3)  
TOP VIEW  
Document # SRAM143 REV A  
Revised October 2011  

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Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, ROHS COMPLIANT, DIP-28
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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28
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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, ROHS COMPLIANT, SOIC-28
P3C1256L70SNI PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28
P3C1256L70SNILF PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, ROHS COMPLIANT, SOIC-28
P3C1256L70SNM PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28
P3C1256L70SNMB PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28
P3C1256L70SNMBLF PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, ROHS COMPLIANT, SOIC-28
P3C1256L70SNMLF PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, ROHS COMPLIANT, SOIC-28
P3C1256L70TC PYRAMID

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Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP-28