Datasheet > P1206H4872DB

P1206H4872DB

更新时间： 2024-02-09 10:56:46

品牌	Logo	应用领域
威世 - VISHAY		电阻器
页数	文件大小	规格书
9页	121K
描述
RESISTOR, THIN FILM, 0.33 W, 0.5 %, 50 ppm, 48700 ohm, SURFACE MOUNT, 1206, CHIP

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技术参数
数据手册

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P1206H4872DB 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	包装说明：	SMT, 1206
Reach Compliance Code：	compliant	风险等级：	5.68
其他特性：	HIGH PRECISION, STANDARD: MIL-PRF-55342G	构造：	Chip
安装特点：	SURFACE MOUNT	端子数量：	2
最高工作温度：	155 °C	最低工作温度：	-55 °C
封装高度：	0.5 mm	封装长度：	3.06 mm
封装形状：	RECTANGULAR PACKAGE	封装形式：	SMT
封装宽度：	1.6 mm	包装方法：	WAFFLE PACK
额定功率耗散 (P)：	0.33 W	额定温度：	70 °C
参考标准：	MIL-PRF-55342G	电阻：	48700 Ω
电阻器类型：	FIXED RESISTOR	系列：	P1206
尺寸代码：	1206	子类别：	Fixed Resistors
表面贴装：	YES	技术：	THIN FILM
温度系数：	50 ppm/ °C	端子面层：	Tin/Lead/Silver - with Nickel barrier
端子形状：	WRAPAROUND	容差：	0.5%
工作电压：	200 V

P1206H4872DB 数据手册

www.vishay.com

POPULAR OPTIONS

Vishay Sfernice

For any option it is recommended to consult Vishay Sfernice for availability first.

Option: Enlarged terminations:

For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint

can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink

(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA

Arrays, CHP Thick Film) www.vishay.com/doc?53048.

Option to order: 0063 (applies to size 1206/1505/2010).

DIMENSIONS (Option 0063) in millimeters

Bottom view for mounting

Uncoatted

ceramic

Enlarged

termination

MAX0 TOL0

+ ꢀ0152

MIN0 TOL0

- ꢀ0152

MAX0 TOL0

+ ꢀ0127

MIN0 TOL0

- ꢀ0127

MAX0 TOL0

+ ꢀ013

MIN0 TOL0

- ꢀ013

MAX0 TOL0

+ ꢀ013

MIN0 TOL0

- ꢀ013

CASE SIZE

NOMINAL

3.06

NOMINAL

1.60

NOMINAL

1.215

NOMINAL

MIN0

MAX0

1206

1505

2010

0.40

3.81

1.32

1.59

0.63

0.50

0.76

0.48

5.08

2.54

2.25

Note

Case size 2512 under development. Please consult Vishay Sfernice.

•

SUGGESTED LAND PATTERN (Option 0063)

G_min.

X_max.

Z_max.

DIMENSIONS (IN MILLIMETER)

G_min0

CHIP SIZE

Z_max0

X_max0

1.73

1.45

2.67

1206

1505

2010

3.91

4.66

5.93

0.50

Note

Case size 2512 under development. Please consult Vishay Sfernice.

•

Revision: 08-Sep-11

Document Number: 53017

For technical questions, contact: sfer@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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