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OR3T80-5BA352I

更新时间: 2024-01-20 09:06:33
品牌 Logo 应用领域
杰尔 - AGERE 现场可编程门阵列可编程逻辑
页数 文件大小 规格书
210页 4391K
描述
3C and 3T Field-Programmable Gate Arrays

OR3T80-5BA352I 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA352,26X26,50
针数:352Reach Compliance Code:unknown
风险等级:5.92最大时钟频率:133 MHz
JESD-30 代码:S-PBGA-B352JESD-609代码:e0
输入次数:294逻辑单元数量:3872
输出次数:294端子数量:352
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA352,26X26,50封装形状:SQUARE
封装形式:GRID ARRAY电源:3.3 V
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
子类别:Field Programmable Gate Arrays标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOMBase Number Matches:1

OR3T80-5BA352I 数据手册

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Data Sheet  
June 1999  
ORCA Series 3C and 3T FPGAs  
Contents  
Table of Contents  
Page Contents  
Page  
Features ......................................................................1  
System-Level Features................................................6  
Description...................................................................7  
FPGA Overview ........................................................7  
PLC Logic ..................................................................7  
PIC Logic ...................................................................8  
System Features .......................................................8  
Routing ......................................................................8  
Configuration .............................................................8  
ORCA Foundry Development System ......................9  
Architecture .................................................................9  
Programmable Logic Cells ........................................11  
Programmable Function Unit ..................................11  
Look-Up Table Operating Modes ............................13  
Supplemental Logic and Interconnect Cell (SLIC) ..21  
PLC Latches/Flip-Flops ...........................................25  
PLC Routing Resources ..........................................27  
PLC Architectural Description .................................34  
Programmable Input/Output Cells .............................36  
5 V Tolerant I/O .......................................................37  
PCI Compliant I/O ...................................................37  
Inputs ......................................................................38  
Outputs ....................................................................41  
PIC Routing Resources ...........................................44  
PIC Architectural Description ..................................45  
High-Level Routing Resources..................................47  
Interquad Routing ....................................................47  
Programmable Corner Cell Routing ........................48  
PIC Interquad (MID) Routing ...................................49  
Clock Distribution Network ........................................50  
PFU Clock Sources .................................................50  
Clock Distribution in the PLC Array .........................51  
Clock Sources to the PLC Array .............................52  
Clocks in the PICs ...................................................52  
ExpressCLK Inputs .................................................53  
Selecting Clock Input Pins ......................................53  
Special Function Blocks ............................................54  
Single Function Blocks ............................................54  
Boundary Scan ........................................................57  
Microprocessor Interface (MPI) .................................64  
PowerPC System ....................................................65  
i960 System ............................................................66  
MPI Interface to FPGA ............................................67  
MPI Setup and Control ............................................68  
Programmable Clock Manager (PCM) ......................72  
PCM Registers ........................................................73  
Delay-Locked Loop (DLL) Mode .............................75  
Phase-Locked Loop (PLL) Mode ............................76  
PCM/FPGA Internal Interface .................................79  
PCM Operation .......................................................79  
PCM Detailed Programming ...................................80  
PCM Applications ....................................................83  
PCM Cautions ........................................................ 84  
FPGA States of Operation........................................ 85  
Initialization ............................................................. 85  
Configuration .......................................................... 86  
Start-Up .................................................................. 87  
Reconfiguration ...................................................... 88  
Partial Reconfiguration ........................................... 88  
Other Configuration Options ................................... 88  
Configuration Data Format ...................................... 89  
Using ORCA Foundry to Generate  
Configuration RAM Data ....................................... 89  
Configuration Data Frame ...................................... 89  
Bit Stream Error Checking ...................................... 91  
FPGA Configuration Modes...................................... 92  
Master Parallel Mode ............................................. 92  
Master Serial Mode ................................................ 93  
Asynchronous Peripheral Mode ............................. 94  
Microprocessor Interface (MPI) Mode .................... 94  
Slave Serial Mode .................................................. 97  
Slave Parallel Mode ............................................... 97  
Daisy-Chaining ....................................................... 98  
Daisy-Chaining with Boundary Scan ...................... 99  
Absolute Maximum Ratings.................................... 100  
Recommended Operating Conditions .................. 100  
Electrical Characteristics ........................................ 101  
Timing Characteristics............................................ 103  
Description ........................................................... 103  
PFU Timing ......................................................... 104  
PLC Timing ........................................................... 111  
SLIC Timing .......................................................... 111  
PIO Timing ........................................................... 112  
Special Function Blocks Timing ........................... 115  
Clock Timing ......................................................... 123  
Configuration Timing ............................................ 133  
Readback Timing ................................................. 142  
Input/Output Buffer Measurement Conditions ........ 143  
Output Buffer Characteristics ................................. 144  
OR3Cxx ................................................................ 144  
OR3Txxx .............................................................. 145  
Estimating Power Dissipation................................. 146  
OR3Cxx ................................................................ 146  
OR3Txxx (Preliminary Information) ...................... 147  
Pin Information ....................................................... 149  
Pin Descriptions ................................................... 149  
Package Compatibility .......................................... 153  
Compatibility with OR2C/TxxA Series .................. 154  
Package Thermal Characteristics........................... 194  
ΘJA ....................................................................... 194  
ψ
JC ...................................................................... 194  
ΘJC ...................................................................... 194  
ΘJB ...................................................................... 194  
FPGA Maximum Junction Temperature ............... 195  
Lucent Technologies Inc.  
2

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