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OR3L165B-8BC432 PDF预览

OR3L165B-8BC432

更新时间: 2024-02-28 23:00:39
品牌 Logo 应用领域
莱迪思 - LATTICE 可编程逻辑
页数 文件大小 规格书
88页 1435K
描述
Field Programmable Gate Array, 8192-Cell, CMOS, PBGA432

OR3L165B-8BC432 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:BGA, BGA432,31X31,50Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:S-PBGA-B432
JESD-609代码:e0输入次数:326
逻辑单元数量:8192输出次数:326
端子数量:432最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA432,31X31,50
封装形状:SQUARE封装形式:GRID ARRAY
电源:2.5,3.3 V可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified子类别:Field Programmable Gate Arrays
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOMBase Number Matches:1

OR3L165B-8BC432 数据手册

 浏览型号OR3L165B-8BC432的Datasheet PDF文件第1页浏览型号OR3L165B-8BC432的Datasheet PDF文件第3页浏览型号OR3L165B-8BC432的Datasheet PDF文件第4页浏览型号OR3L165B-8BC432的Datasheet PDF文件第5页浏览型号OR3L165B-8BC432的Datasheet PDF文件第6页浏览型号OR3L165B-8BC432的Datasheet PDF文件第7页 
Data Addendum  
January 2002  
ORCA OR3LxxxB Series FPGAs  
Table of Contents  
Page Contents  
Contents  
Page  
Introduction................................................................ 1  
Features .................................................................... 1  
System-Level Features.............................................. 4  
Support...................................................................... 5  
Description ................................................................ 5  
FPGA Overview ...................................................... 5  
PLC Logic ............................................................... 5  
PIC Logic ................................................................ 8  
System Features..................................................... 9  
Routing.................................................................... 9  
Conguration........................................................... 9  
Configuration Data Format...................................... 9  
Series 3L I/Os and 5 V Tolerance......................... 10  
Designing with ORCA Series 3T Parts with  
Series 3L in Mind................................................ 10  
Powerup Sequencing for Series 3L Devices......... 10  
ORCA Foundry Development System .................. 11  
Additional Information ........................................... 11  
Timing Characteristics............................................. 12  
Configuration Timing............................................. 12  
PFU Timing........................................................... 13  
PLC Timing ........................................................... 19  
SLIC Timing .......................................................... 19  
PIO Timing............................................................ 20  
Special Function Blocks Timing............................ 23  
Clock Timing ......................................................... 25  
Description............................................................ 35  
Estimating Power Dissipation................................. 37  
OR3LxxxB............................................................ 37  
Pin Information ....................................................... 38  
Absolute Maximum Ratings.................................... 76  
Recommended Operating Conditions .................... 76  
Electrical Characteristics........................................ 77  
Package Thermal Characteristics .......................... 78  
ΘJA ...................................................................... 78  
ψJC ...................................................................... 78  
ΘJC ...................................................................... 78  
ΘJB ...................................................................... 78  
FPGA Maximum Junction Temperature .............. 79  
Package Coplanarity .............................................. 80  
Package Parasitics................................................. 80  
Package Outline Diagrams..................................... 81  
Terms and Definitions.......................................... 81  
208-Pin SQFP2.................................................... 82  
240-Pin SQFP2.................................................... 83  
352-Pin PBGA ..................................................... 84  
432-Pin EBGA ..................................................... 85  
680-Pin PBGAM .................................................. 86  
Ordering Information .............................................. 87  
2
Lattice Semiconductor  

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