PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
OPT101P
PACKAGE-LEAD
DIP-8
NTC
–25°C to +85°C
–25°C to +85°C
OPT101
OPT101
OPT101P
Rail, 50
Rail, 50
OPT101P-J
DIP-8, Surface Mount(2)
DTL
OPT101P-J
NOTES: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet. (2) 8-pin DIP with J-formed
leads for surface mounting.
PIN CONFIGURATIONS
ELECTROSTATIC
DISCHARGE SENSITIVITY
Top View
DIP
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
VS
–In
–V
1
2
3
4
8
7
6
5
Common
NC
(1)
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NC
1MΩ Feedback
Output
NOTE: (1) Photodiode location.
MOISTURE SENSITIVITY
AND SOLDERING
Clear plastic does not contain the structural-enhancing fillers
used in black plastic molding compound. As a result, clear
plastic is more sensitive to environmental stress than black
plastic. This can cause difficulties if devices have been stored
in high humidity prior to soldering. The rapid heating during
soldering can stress wire bonds and cause failures. Prior to
soldering,itisrecommendedthatplasticdevicesbebaked-out
at +85°C for 24 hours.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage (VS to “Common” or pin 3) ................................ 0 to +36V
Output Short-Circuit (to ground)............................................... Continuous
Operating Temperature .................................................... –25°C to +85°C
Storage Temperature ........................................................ –25°C to +85°C
Junction Temperature ...................................................................... +85°C
Lead Temperature (soldering, 10s) ............................................... +300°C
(Vapor-Phase Soldering Not Recommended)
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
The fire-retardant fillers used in black plastic are not compat-
ible with clear molding compound. The OPT101 plastic
packages cannot meet flammability test, UL-94.
OPT101
4
SBBS002A
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