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OPT101_03 PDF预览

OPT101_03

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
BB 光电二极管光电二极管放大器
页数 文件大小 规格书
15页 389K
描述
MONOLITHIC PHOTODIODE AND SINGLE-SUPPLY TRANSIMPEDANCE AMPLIFIER

OPT101_03 数据手册

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PACKAGE/ORDERING INFORMATION(1)  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESIGNATOR  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
OPT101P  
PACKAGE-LEAD  
DIP-8  
NTC  
25°C to +85°C  
25°C to +85°C  
OPT101  
OPT101  
OPT101P  
Rail, 50  
Rail, 50  
OPT101P-J  
DIP-8, Surface Mount(2)  
DTL  
OPT101P-J  
NOTES: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet. (2) 8-pin DIP with J-formed  
leads for surface mounting.  
PIN CONFIGURATIONS  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Top View  
DIP  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
VS  
In  
V  
1
2
3
4
8
7
6
5
Common  
NC  
(1)  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet its published  
specifications.  
NC  
1MFeedback  
Output  
NOTE: (1) Photodiode location.  
MOISTURE SENSITIVITY  
AND SOLDERING  
Clear plastic does not contain the structural-enhancing fillers  
used in black plastic molding compound. As a result, clear  
plastic is more sensitive to environmental stress than black  
plastic. This can cause difficulties if devices have been stored  
in high humidity prior to soldering. The rapid heating during  
soldering can stress wire bonds and cause failures. Prior to  
soldering,itisrecommendedthatplasticdevicesbebaked-out  
at +85°C for 24 hours.  
ABSOLUTE MAXIMUM RATINGS(1)  
Supply Voltage (VS to Commonor pin 3) ................................ 0 to +36V  
Output Short-Circuit (to ground)............................................... Continuous  
Operating Temperature .................................................... 25°C to +85°C  
Storage Temperature ........................................................ 25°C to +85°C  
Junction Temperature ...................................................................... +85°C  
Lead Temperature (soldering, 10s) ............................................... +300°C  
(Vapor-Phase Soldering Not Recommended)  
NOTE: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may degrade  
device reliability. These are stress ratings only, and functional operation of the  
device at these or any other conditions beyond those specified is not implied.  
The fire-retardant fillers used in black plastic are not compat-  
ible with clear molding compound. The OPT101 plastic  
packages cannot meet flammability test, UL-94.  
OPT101  
4
SBBS002A  
www.ti.com  

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